Littelfuse, Inc. Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYH75N65C3D1 IXYH75N65C3D1

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
Powered by GS/AI

The IXYH75N65C3D1 is a 650 V IGBT with a continuous collector current rating of 75 A at 110°C, packaged in a TO-247 AD case. It features an optimized design for 20-60 kHz switching, a square reverse bias safe operating area (RBSOA), avalanche capability, and a short-circuit rated ultra-fast anti-parallel freewheeling diode. The device has a maximum junction temperature of 175°C, a thermal resistance from junction to case of 0.20 °C/W for the IGBT and 0.45 °C/W for the diode, and meets RoHS standards. It is rated for a maximum mounting torque of 1.13 Nm and weighs 6 g. The IGBT exhibits a collector-emitter saturation voltage of 1.8-2.3 V at 60 A and 15 V gate drive, and supports a transient collector-emitter voltage of up to 30 V.

Datasheet Summary
Powered by GS/AI

The IXYH75N65C3D1 is a 650 V IGBT with a continuous collector current rating of 75 A at 110°C, packaged in a TO-247 AD case. It features an optimized design for 20-60 kHz switching, a square reverse bias safe operating area (RBSOA), avalanche capability, and a short-circuit rated ultra-fast anti-parallel freewheeling diode. The device has a maximum junction temperature of 175°C, a thermal resistance from junction to case of 0.20 °C/W for the IGBT and 0.45 °C/W for the diode, and meets RoHS standards. It is rated for a maximum mounting torque of 1.13 Nm and weighs 6 g. The IGBT exhibits a collector-emitter saturation voltage of 1.8-2.3 V at 60 A and 15 V gate drive, and supports a transient collector-emitter voltage of up to 30 V.

Suppliers

Company
Product
Description
Supplier Links
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYH75N65C3D1 - IXYH75N65C3D1 - Littelfuse, Inc.
Rosemont, IL, United States
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYH75N65C3D1
IXYH75N65C3D1
Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYH75N65C3D1 IXYH75N65C3D1
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYH75N65C3D1
Product Name Power Semiconductors & Control ICs - IGBTs - XPT - Series: Planar - IXYH75N65C3D1
VCES 650 volts
Unlock Full Specs
to access all available technical data