Littelfuse, Inc. 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYH75N65C3

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
  • 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs - IXYH75N65C3 - Littelfuse, Inc.
    Littelfuse, Inc.
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXYH75N65C3 is a 650V IGBT designed for 20-60kHz switching applications in power inverters, UPS, motor drives, and SMPS. It is packaged in a TO-247AD case with a weight of 6 g. The device has a continuous collector current rating of 75 A at 110°C and a peak collector current of 360 A at 25°C for 1 ms. Its collector-emitter saturation voltage is 1.8 V to 2.3 V at 60 A and 15 V gate voltage. The IGBT features a square RBSOA, avalanche ruggedness, and short-circuit capability with a maximum junction temperature of 175°C. Thermal resistance from junction to case is 0.20 °C/W. The device is rated for a maximum gate-emitter voltage of ±20 V continuous and ±30 V transient. Mounting torque is specified at 1.13 Nm (10 lb.in).

Datasheet Summary
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The IXYH75N65C3 is a 650V IGBT designed for 20-60kHz switching applications in power inverters, UPS, motor drives, and SMPS. It is packaged in a TO-247AD case with a weight of 6 g. The device has a continuous collector current rating of 75 A at 110°C and a peak collector current of 360 A at 25°C for 1 ms. Its collector-emitter saturation voltage is 1.8 V to 2.3 V at 60 A and 15 V gate voltage. The IGBT features a square RBSOA, avalanche ruggedness, and short-circuit capability with a maximum junction temperature of 175°C. Thermal resistance from junction to case is 0.20 °C/W. The device is rated for a maximum gate-emitter voltage of ±20 V continuous and ±30 V transient. Mounting torque is specified at 1.13 Nm (10 lb.in).

Suppliers

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600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs - IXYH75N65C3 - Littelfuse, Inc.
Littelfuse, Inc.
Rosemont, IL, United States
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
IXYH75N65C3
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXYH75N65C3
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYH75N65C3
Product Name 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 650 volts
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