Littelfuse, Inc. Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYH55N120B4H1

Description
Developed using our proprietary XPT™ thin-wafer technology and state-of-the-art Trench IGBT process, these devices feature reduced thermal resistance, low energy losses, fast switching, low tail current, and high current densities. These IGBTs have breakdown voltage from 650V till 1200V, making them ideal for snubber-less hard-switching applications. Other qualities include a positive collector-to-emitter voltage temperature coefficient which enables designers to use multiple devices in parallel to meet high current requirements and low gate charges which help reduce gate drive requirements and switching losse Advantages: Hard-switching capabilities High power densities Temperature stability of diode forward voltage VF Low gate drive requirements Low Vcesat, low Eon/Eoff High surge current capability and short circuit capability Positive thermal coefficient of Vcesat
Description
Developed using our proprietary XPT™ thin-wafer technology and state-of-the-art Trench IGBT process, these devices feature reduced thermal resistance, low energy losses, fast switching, low tail current, and high current densities. These IGBTs have breakdown voltage from 650V till 1200V, making them ideal for snubber-less hard-switching applications. Other qualities include a positive collector-to-emitter voltage temperature coefficient which enables designers to use multiple devices in parallel to meet high current requirements and low gate charges which help reduce gate drive requirements and switching losse Advantages: Hard-switching capabilities High power densities Temperature stability of diode forward voltage VF Low gate drive requirements Low Vcesat, low Eon/Eoff High surge current capability and short circuit capability Positive thermal coefficient of Vcesat
Datasheet
Datasheet Summary
Powered by GS/AI

The IXYH55N120B4H1 is a 1200 V, 55 A XPT Gen4 IGBT with an anti-parallel sonic diode, housed in a TO-247-3L package measuring 20.79 to 21.45 mm in diameter and 19.80 to 20.30 mm in length. It features a collector-emitter saturation voltage of 2.1 V at 55 A and 15 V gate drive, a turn-off fall time of 146 ns, and a junction temperature range from -55 °C to 175 °C. Thermal resistance from junction to case is 0.23 °C/W for the IGBT and 0.35 °C/W for the diode. The device meets AEC-Q200 and RoHS standards, and is designed for 5-30 kHz switching applications such as motor drives, power inverters, and UPS systems.

Datasheet Summary
Powered by GS/AI

The IXYH55N120B4H1 is a 1200 V, 55 A XPT Gen4 IGBT with an anti-parallel sonic diode, housed in a TO-247-3L package measuring 20.79 to 21.45 mm in diameter and 19.80 to 20.30 mm in length. It features a collector-emitter saturation voltage of 2.1 V at 55 A and 15 V gate drive, a turn-off fall time of 146 ns, and a junction temperature range from -55 °C to 175 °C. Thermal resistance from junction to case is 0.23 °C/W for the IGBT and 0.35 °C/W for the diode. The device meets AEC-Q200 and RoHS standards, and is designed for 5-30 kHz switching applications such as motor drives, power inverters, and UPS systems.

Suppliers

Company
Product
Description
Supplier Links
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs - IXYH55N120B4H1 - Littelfuse, Inc.
Rosemont, IL, United States
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
IXYH55N120B4H1
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYH55N120B4H1
Developed using our proprietary XPT™ thin-wafer technology and state-of-the-art Trench IGBT process, these devices feature reduced thermal resistance, low energy losses, fast switching, low tail current, and high current densities. These IGBTs have breakdown voltage from 650V till 1200V, making them ideal for snubber-less hard-switching applications. Other qualities include a positive collector-to-emitter voltage temperature coefficient which enables designers to use multiple devices in parallel to meet high current requirements and low gate charges which help reduce gate drive requirements and switching losse Advantages: Hard-switching capabilities High power densities Temperature stability of diode forward voltage VF Low gate drive requirements Low Vcesat, low Eon/Eoff High surge current capability and short circuit capability Positive thermal coefficient of Vcesat

Developed using our proprietary XPT™ thin-wafer technology and state-of-the-art Trench IGBT process, these devices feature reduced thermal resistance, low energy losses, fast switching, low tail current, and high current densities. These IGBTs have breakdown voltage from 650V till 1200V, making them ideal for snubber-less hard-switching applications. Other qualities include a positive collector-to-emitter voltage temperature coefficient which enables designers to use multiple devices in parallel to meet high current requirements and low gate charges which help reduce gate drive requirements and switching losse Advantages: Hard-switching capabilities High power densities Temperature stability of diode forward voltage VF Low gate drive requirements Low Vcesat, low Eon/Eoff High surge current capability and short circuit capability Positive thermal coefficient of Vcesat

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYH55N120B4H1
Product Name Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 1200 volts
Unlock Full Specs
to access all available technical data