Littelfuse, Inc. Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYH40N120B4

Description
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low gate drive requirements Low on-state voltages Vcesat Optimized for medium switching frequencies 10kHz up to 30kHz Positive thermal coefficient of Vcesat International standard packages
Description
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low gate drive requirements Low on-state voltages Vcesat Optimized for medium switching frequencies 10kHz up to 30kHz Positive thermal coefficient of Vcesat International standard packages
Datasheet
Datasheet Summary
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The IXYH40N120B4 is a 1200V, 40A IGBT designed for switching applications between 5 and 30 kHz, featuring optimized switching losses and a positive thermal coefficient of Vce(sat) to enable parallel operation. It is packaged in a TO-247 case with a thermal resistance of 0.22 °C/W from junction to case. Rated for continuous collector current of 40 A at 110°C and peak pulse current of 250 A at 25°C, it operates with a gate-emitter voltage range of ±20 V continuous and ±30 V transient. The device meets international standard package requirements and is rated for junction and storage temperatures from −55°C to 175°C. It supports clamped inductive switching with a RBSOA of 80 A at 150°C and 15 V gate drive.

Datasheet Summary
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The IXYH40N120B4 is a 1200V, 40A IGBT designed for switching applications between 5 and 30 kHz, featuring optimized switching losses and a positive thermal coefficient of Vce(sat) to enable parallel operation. It is packaged in a TO-247 case with a thermal resistance of 0.22 °C/W from junction to case. Rated for continuous collector current of 40 A at 110°C and peak pulse current of 250 A at 25°C, it operates with a gate-emitter voltage range of ±20 V continuous and ±30 V transient. The device meets international standard package requirements and is rated for junction and storage temperatures from −55°C to 175°C. It supports clamped inductive switching with a RBSOA of 80 A at 150°C and 15 V gate drive.

Suppliers

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Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs - IXYH40N120B4 - Littelfuse, Inc.
Rosemont, IL, United States
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
IXYH40N120B4
Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs IXYH40N120B4
Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low gate drive requirements Low on-state voltages Vcesat Optimized for medium switching frequencies 10kHz up to 30kHz Positive thermal coefficient of Vcesat International standard packages

Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.Advantages: Ideal for high power density and high inrush currents, low loss applications Hard-switching capable Easy paralleling of devices Reduced gate driver requirements Ease of replacement and availability of isolation package Low gate drive requirements Low on-state voltages Vcesat Optimized for medium switching frequencies 10kHz up to 30kHz Positive thermal coefficient of Vcesat International standard packages

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXYH40N120B4
Product Name Trench Series - 650V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 1200 volts
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