Littelfuse, Inc. 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXXQ30N60B3M

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXXQ30N60B3M is a 600V insulated-gate bipolar transistor optimized for 5-30 kHz switching in applications such as power inverters, motor drives, and SMPS. It is housed in an overmolded package with an electrically isolated tab and weighs 5 g. The device has a continuous collector current rating of 19 A at 110°C and a pulsed collector current of 140 A. Its collector-emitter saturation voltage is 1.85 V at 24 A and 15 V gate drive. The device supports a maximum junction temperature of 175°C and offers a thermal resistance from junction to case of 1.66 °C/W. It has square reverse bias safe operating area (RBSOA), avalanche capability, and short-circuit immunity, with 2500 V~ electrical isolation. The gate-emitter threshold voltage ranges from 3.0 to 5.5 V, and the device is rated for a maximum gate-emitter voltage of ±20 V continuous and ±30 V transient.

Datasheet Summary
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The IXXQ30N60B3M is a 600V insulated-gate bipolar transistor optimized for 5-30 kHz switching in applications such as power inverters, motor drives, and SMPS. It is housed in an overmolded package with an electrically isolated tab and weighs 5 g. The device has a continuous collector current rating of 19 A at 110°C and a pulsed collector current of 140 A. Its collector-emitter saturation voltage is 1.85 V at 24 A and 15 V gate drive. The device supports a maximum junction temperature of 175°C and offers a thermal resistance from junction to case of 1.66 °C/W. It has square reverse bias safe operating area (RBSOA), avalanche capability, and short-circuit immunity, with 2500 V~ electrical isolation. The gate-emitter threshold voltage ranges from 3.0 to 5.5 V, and the device is rated for a maximum gate-emitter voltage of ±20 V continuous and ±30 V transient.

Suppliers

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Supplier Links
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs - IXXQ30N60B3M - Littelfuse, Inc.
Rosemont, IL, United States
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
IXXQ30N60B3M
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXXQ30N60B3M
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXXQ30N60B3M
Product Name 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 600 volts
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