Littelfuse, Inc. 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXXP50N60B3

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXXP50N60B3 is a 600V IGBT in a TO-220 package designed for 5-30 kHz switching applications. It has a continuous collector current rating of 50 A at 110°C and a peak collector current of 200 A for 1 ms. The device features a maximum collector-emitter saturation voltage of 1.80 V at 36 A and 15 V gate drive, and a maximum power dissipation of 600 W at 25°C. Thermal resistance from junction to case is 0.50 °C/W. It supports a junction temperature range of -55°C to 175°C, with a maximum lead temperature for soldering of 300°C for 10 seconds. The IGBT has a square reverse-bias safe operating area, avalanche capability, and short-circuit endurance. It is rated for international standard packages and is suitable for applications including power inverters, UPS, motor drives, SMPS, PFC circuits, and welding machines.

Datasheet Summary
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The IXXP50N60B3 is a 600V IGBT in a TO-220 package designed for 5-30 kHz switching applications. It has a continuous collector current rating of 50 A at 110°C and a peak collector current of 200 A for 1 ms. The device features a maximum collector-emitter saturation voltage of 1.80 V at 36 A and 15 V gate drive, and a maximum power dissipation of 600 W at 25°C. Thermal resistance from junction to case is 0.50 °C/W. It supports a junction temperature range of -55°C to 175°C, with a maximum lead temperature for soldering of 300°C for 10 seconds. The IGBT has a square reverse-bias safe operating area, avalanche capability, and short-circuit endurance. It is rated for international standard packages and is suitable for applications including power inverters, UPS, motor drives, SMPS, PFC circuits, and welding machines.

Suppliers

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Supplier Links
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs - IXXP50N60B3 - Littelfuse, Inc.
Rosemont, IL, United States
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
IXXP50N60B3
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXXP50N60B3
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXXP50N60B3
Product Name 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 600 volts
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