Littelfuse, Inc. 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXA55I1200HJ

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXA55I1200HJ is a single IGBT designed for high-power applications such as AC motor drives, solar inverters, and uninterruptible power supplies. It is packaged in an ISOPLUS247 case with a backside DCB ceramic for improved thermal performance and a weight of 6 g. The device has a collector-emitter voltage rating of 1200 V and a continuous collector current of 84 A at 25°C, with a saturation voltage of 1.8 V at 50 A and 25°C. It is rated for a total power dissipation of 290 W, features a positive temperature coefficient of on-state voltage, and is short-circuit rated for 10 µs. The gate-emitter threshold voltage ranges from 5.5 to 6.5 V, and total gate charge is 190 nC. Thermal resistance from junction to case is 0.43 K/W. The device meets RoHS compliance and its epoxy molding compound is UL 94 V-0 rated.

Datasheet Summary
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The IXA55I1200HJ is a single IGBT designed for high-power applications such as AC motor drives, solar inverters, and uninterruptible power supplies. It is packaged in an ISOPLUS247 case with a backside DCB ceramic for improved thermal performance and a weight of 6 g. The device has a collector-emitter voltage rating of 1200 V and a continuous collector current of 84 A at 25°C, with a saturation voltage of 1.8 V at 50 A and 25°C. It is rated for a total power dissipation of 290 W, features a positive temperature coefficient of on-state voltage, and is short-circuit rated for 10 µs. The gate-emitter threshold voltage ranges from 5.5 to 6.5 V, and total gate charge is 190 nC. Thermal resistance from junction to case is 0.43 K/W. The device meets RoHS compliance and its epoxy molding compound is UL 94 V-0 rated.

Suppliers

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600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs - IXA55I1200HJ - Littelfuse, Inc.
Rosemont, IL, United States
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
IXA55I1200HJ
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXA55I1200HJ
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXA55I1200HJ
Product Name 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 1200 volts
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