Littelfuse, Inc. 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXA4IF1200UC

Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Description
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package
Datasheet
Datasheet Summary
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The IXA4IF1200UC is a 1200 V XPT IGBT with a 9 A collector current rating at 25°C, packaged in a TO-252 (DPak) case. It features a collector-emitter saturation voltage of 1.8 V at 3 A and 25°C, a total gate charge of 12 nC, and a short-circuit withstand time of 10 µs. The device includes a copackaged SONIC™ diode with a 10 A forward current rating and 0.5 µC reverse recovery charge. It meets RoHS standards and its epoxy compound complies with UL 94 V-0. Thermal resistance from junction to case is 2.7 K/W for the IGBT and 3 K/W for the diode. The operating temperature range is from -40°C to 125°C.

Datasheet Summary
Powered by GS/AI

The IXA4IF1200UC is a 1200 V XPT IGBT with a 9 A collector current rating at 25°C, packaged in a TO-252 (DPak) case. It features a collector-emitter saturation voltage of 1.8 V at 3 A and 25°C, a total gate charge of 12 nC, and a short-circuit withstand time of 10 µs. The device includes a copackaged SONIC™ diode with a 10 A forward current rating and 0.5 µC reverse recovery charge. It meets RoHS standards and its epoxy compound complies with UL 94 V-0. Thermal resistance from junction to case is 2.7 K/W for the IGBT and 3 K/W for the diode. The operating temperature range is from -40°C to 125°C.

Suppliers

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Product
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600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs - IXA4IF1200UC - Littelfuse, Inc.
Rosemont, IL, United States
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
IXA4IF1200UC
600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs IXA4IF1200UC
Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements. Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications. Advantages: Hard-switching capability High power density Low gate drive requirements Optimized for mid- and high-switching frequencies Square RBSOA Short circuit capability Ultra-fast anti-parallel diodes International standard package

Supplier's Site Datasheet

Technical Specifications

  Littelfuse, Inc.
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number IXA4IF1200UC
Product Name 600V - 1200V XPT™ (eXtreme-light Punch Through) IGBTs
VCES 1200 volts
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