Laird Technologies Thermally Conductive Chip Pad; Thickness Laird KA150-2AC-33X33

Description
THERMALLY CONDUCTIVE CHIP PAD; Thickness:0.16mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:0.49°C/W; Volume Resistivity:-; External Length:300mm; External Width:300mm; Product Range:
Datasheet
Description
THERMALLY CONDUCTIVE CHIP PAD; Thickness:0.16mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:0.49°C/W; Volume Resistivity:-; External Length:300mm; External Width:300mm; Product Range:
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Chip Pad; Thickness Laird - 24M3183 - Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Chip Pad; Thickness Laird
24M3183
Thermally Conductive Chip Pad; Thickness Laird 24M3183
THERMALLY CONDUCTIVE CHIP PAD; Thickness:0.16mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:0.49°C/W; Volume Resistivity:-; External Length:300mm; External Width:300mm; Product Range:

THERMALLY CONDUCTIVE CHIP PAD; Thickness:0.16mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:0.49°C/W; Volume Resistivity:-; External Length:300mm; External Width:300mm; Product Range:

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 24M3183
Product Name Thermally Conductive Chip Pad; Thickness Laird
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Pads - 625761 - RS Components, Ltd.
RS Components, Ltd.
Specs
Thermal Conductivity 1 W/m-K (0.5778 BTU-ft/hr-ft²-F)
View Details
Heat Transfer Compound - T-99 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
M-Speed HF -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Industry Electronics; Semiconductors, IC's
View Details