Laird Technologies Thermally Conductive Chip Pad; Thickness Laird KA150-2AC-33X33

Description
THERMALLY CONDUCTIVE CHIP PAD; Thickness:0.16mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:0.49°C/W; Volume Resistivity:-; External Length:300mm; External Width:300mm; Product Range:
  • Thermally Conductive Chip Pad; Thickness Laird - 24M3183 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMALLY CONDUCTIVE CHIP PAD; Thickness:0.16mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:0.49°C/W; Volume Resistivity:-; External Length:300mm; External Width:300mm; Product Range:
Datasheet

Suppliers

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Product
Description
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Thermally Conductive Chip Pad; Thickness Laird - 24M3183 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Chip Pad; Thickness Laird
24M3183
Thermally Conductive Chip Pad; Thickness Laird 24M3183
THERMALLY CONDUCTIVE CHIP PAD; Thickness:0.16mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:0.49°C/W; Volume Resistivity:-; External Length:300mm; External Width:300mm; Product Range:

THERMALLY CONDUCTIVE CHIP PAD; Thickness:0.16mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:0.49°C/W; Volume Resistivity:-; External Length:300mm; External Width:300mm; Product Range:

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 24M3183
Product Name Thermally Conductive Chip Pad; Thickness Laird
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