THERMALLY CONDUCTIVE CHIP PAD; Thickness:0.16mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:0.49°C/W; Volume Resistivity:-; External Length:300mm; External Width:300mm; Product Range:
| Newark, An Avnet Company | |
|---|---|
| Product Category | Thermal Compounds and Thermal Interface Materials |
| Product Number | 24M3183 |
| Product Name | Thermally Conductive Chip Pad; Thickness Laird |
