Laird Technologies Pads, Sheets, Bridges A16107-13

Description
THERM PAD 457.2X457.2MM GRAY
  • Pads, Sheets, Bridges - 926-A16107-13-ND - DigiKey
    DigiKey
Request a Quote Datasheet
Description
THERM PAD 457.2X457.2MM GRAY
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pads, Sheets, Bridges - 926-A16107-13-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
926-A16107-13-ND
Pads, Sheets, Bridges 926-A16107-13-ND
THERM PAD 457.2X457.2MM GRAY

THERM PAD 457.2X457.2MM GRAY

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Leveling and Filling Compounds
Product Number 926-A16107-13-ND
Product Name Pads, Sheets, Bridges
Thermal Conductivity 1.8 W/m-K (1.04 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Liquid Gap Fillers for Electronics - Electrolube ® LGF200 Liquid Gap Filler - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Liquid Gap Fillers for Electronics
Electrolube ® LGF200 Liquid Gap Filler
Specs
Cure / Technology Two Component  
Type / Form Liquid
Features Electrically Conductive; Sealant
View Details
One Component, High Viscosity UV Curable Compound - UV15X-5 - Master Bond, Inc.
Master Bond, Inc.
One Component, High Viscosity UV Curable Compound
UV15X-5
Specs
Cure / Technology Thermoset; Single Component
Chemical System Elastomeric
Type / Form Liquid
View Details
Fillers & Putties - 4479719 - RS Components, Ltd.
RS Components, Ltd.
Fillers & Putties
4479719
Specs
Type / Form Liquid
Features Sealant
Use Temperature 122 F (50 C)
View Details
Thermal Interface Materials - BERGQUIST SIL PAD TSP K900 - Henkel Corporation - Industrial
Henkel Corporation - Industrial
Thermal Interface Materials
BERGQUIST SIL PAD TSP K900
Specs
Features Adhesive
Use Temperature 140 to 356 F (60 to 180 C)
Thermal Conductivity 0.9000 W/m-K (0.5200 BTU-ft/hr-ft²-F)
View Details