Laird Technologies Pads, Sheets, Bridges A15324-01

Description
Thermal Pad Green 228.60mm x 228.60mm Square
Request a Quote Datasheet
Description
Thermal Pad Green 228.60mm x 228.60mm Square
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pads, Sheets, Bridges - A15324-01-ND - DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
A15324-01-ND
Pads, Sheets, Bridges A15324-01-ND
Thermal Pad Green 228.60mm x 228.60mm Square

Thermal Pad Green 228.60mm x 228.60mm Square

Buy Now Datasheet
Thermal Gap Filler, 229 X 229Mm, 1Mm; Thermal Conductivity Laird - 52Y0857 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Gap Filler, 229 X 229Mm, 1Mm; Thermal Conductivity Laird
52Y0857
Thermal Gap Filler, 229 X 229Mm, 1Mm; Thermal Conductivity Laird 52Y0857
THERMAL GAP FILLER, 229 X 229MM, 1MM; Thermal Conductivity:1.2W/m. K; Conductive Material:Silicone Elastomer; Thickness:1mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; External Width:229mm; Product Range:Tflex RoHS Compliant: Yes

THERMAL GAP FILLER, 229 X 229MM, 1MM; Thermal Conductivity:1.2W/m.K; Conductive Material:Silicone Elastomer; Thickness:1mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; External Width:229mm; Product Range:Tflex RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  DigiKey Newark, An Avnet Company
Product Category Leveling and Filling Compounds Thermal Compounds and Thermal Interface Materials
Product Number A15324-01-ND 52Y0857
Product Name Pads, Sheets, Bridges Thermal Gap Filler, 229 X 229Mm, 1Mm; Thermal Conductivity Laird
Thermal Conductivity 1.2 W/m-K (0.6933 BTU-ft/hr-ft²-F) 1.2 W/m-K (0.6933 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Thin Flim, General Purpose with 0.05mm Glass Cloth Reinforcement - SARCON ® GTR - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0059 to 0.0118 inch (0.1500 to 0.3000 mm)
Industry Electronics; Semiconductors, IC's
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed - QSil-553 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics; OEM or Industrial
Features Flame Retardant; UL Rating
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details