Laird Technologies RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 4A66PA51H01800

Description
GASKT FAB/FOAM 12.7X457.2MM BELL
  • RFI and EMI - Contacts, Fingerstock and Gaskets - 4A66PA51H01800 - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Datasheet
Description
GASKT FAB/FOAM 12.7X457.2MM BELL
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Acme Chip Technology Co., Limited
Shenzhen, China
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
4A66PA51H01800
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 4A66PA51H01800
GASKT FAB/FOAM 12.7X457.2MM BELL

GASKT FAB/FOAM 12.7X457.2MM BELL

Supplier's Site
RFI and EMI - Contacts, Fingerstock and Gaskets - 4A66PA51H01800 - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
RFI and EMI - Contacts, Fingerstock and Gaskets
4A66PA51H01800
RFI and EMI - Contacts, Fingerstock and Gaskets 4A66PA51H01800
GASKT FAB/FOAM 12.7X457.2MM BELL

GASKT FAB/FOAM 12.7X457.2MM BELL

Buy Now Datasheet

Technical Specifications

  Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Electrodes and Electrode Materials Electrodes and Electrode Materials
Product Number 4A66PA51H01800 4A66PA51H01800
Product Name RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets RFI and EMI - Contacts, Fingerstock and Gaskets
Shape / Form Fabric Over Foam
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