Laird Technologies RFI and EMI - Contacts, Fingerstock and Gaskets 4053PA51H01800

Description
GSKT FAB/FOAM 2.3X457.2MM DSHAPE
  • RFI and EMI - Contacts, Fingerstock and Gaskets - 4053PA51H01800 - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Datasheet
Description
GSKT FAB/FOAM 2.3X457.2MM DSHAPE
Datasheet

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Product
Description
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RFI and EMI - Contacts, Fingerstock and Gaskets - 4053PA51H01800 - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
RFI and EMI - Contacts, Fingerstock and Gaskets
4053PA51H01800
RFI and EMI - Contacts, Fingerstock and Gaskets 4053PA51H01800
GSKT FAB/FOAM 2.3X457.2MM DSHAPE

GSKT FAB/FOAM 2.3X457.2MM DSHAPE

Buy Now Datasheet
Acme Chip Technology Co., Limited
Shenzhen, China
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
4053PA51H01800
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 4053PA51H01800
GSKT FAB/FOAM 2.3X457.2MM DSHAPE

GSKT FAB/FOAM 2.3X457.2MM DSHAPE

Supplier's Site

Technical Specifications

  Quarktwin Technology Ltd. Acme Chip Technology Co., Limited
Product Category Electrodes and Electrode Materials Electrodes and Electrode Materials
Product Number 4053PA51H01800 4053PA51H01800
Product Name RFI and EMI - Contacts, Fingerstock and Gaskets RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
Type Contact; Fabric Over Foam
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