E-114 is a low cure temperature, non sag high performance filled single component epoxy adhesive whichcan be cured at 100°C or 120°C to provide good shear strength in combination with good temperatureresistanc
e. Especially suitable for assembley applications such as building precisionelectric motors or otherelectromechanic
al devices. Offers much higher hot bond strength and long term durability then modifiedacrylic adhesives or conventional epoxies. Has good adhesion to plastics as well as metal and ceramics, notrecomended for copper alloys.
E-114 is a low cure temperature, non sag high performance filled single component epoxy adhesive whichcan be cured at 100°C or 120°C to provide good shear strength in combination with good temperatureresistance. Especially suitable for assembley applications such as building precisionelectric motors or otherelectromechanical devices. Offers much higher hot bond strength and long term durability then modifiedacrylic adhesives or conventional epoxies. Has good adhesion to plastics as well as metal and ceramics, notrecomended for copper alloys.
