Designed for the production of micro-optical components and wafer scale patterning
Thickness up to 270 μm by spin coating (OrmoClear®30)
Highly transparent for near UV and VIS down to 350 nm
High thermal and mechanical stability
For UV imprint and UV moulding
Designed for the production of micro-optical components and wafer scale patterning
- Thickness up to 270 μm by spin coating (OrmoClear®30)
- Highly transparent for near UV and VIS down to 350 nm
- High thermal and mechanical stability
- For UV imprint and UV moulding
