The SS-BGA676C-01 Spring Pin Socket from Ironwood Electronics, Inc. is designed for high bandwidth applications, suitable for prototype, test, and burn-in processes. This socket utilizes spring pin technology, allowing for a solder-less connection that can be easily mounted onto a PCB using the provided hardware. The footprint of the socket is only 5mm larger than the maximum IC size, ensuring a compact design. It is compatible with the SG-BGA elastomer socket footprint, providing flexibility in design. The spring pins feature a low resistance of less than 0.02,Ѷ and can handle a continuous current rating of 4.0A in free air. The operating temperature range is from -40¬8 to 150¬8 C, making it suitable for various environmental conditions. Regular maintenance and cleaning procedures are recommended to ensure optimal performance and longevity of the socket.
SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware. The PCB should have mounting and
alignment holes at proper locations (see page 2 of the drawing for recommended PCB
layout information). The typical SS-BGA socket footprint is only 5mm larger than the maximum IC size. It is compatible with the alternate SG-BGA (elastomer) socket footprint.
| Ironwood Electronics, Inc. | |
|---|---|
| Product Category | IC Interconnect Components |
| Product Number | SS-BGA676C-01 |
| Product Name | Spring Pin Socket |
| Product Type | IC Socket |
| Socket Type | BGA |
| Mounting | ZIF, Direct Mount, Solderless |
| Features | Solderless; ZIF Lock; Clamshell Socket |
