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Sensata Technologies 777 Series CSP Devices

Description
Open top chip scale package and fine pitch BGA's Accommodates pitch sizes of 0.65mm, 0.75mm, and 0.8mm Compact size and low actuation force 4-Point pitch contact design for enhanced electrical contact Unique mechanism to eliminate solder ball sticking Field replaceable package location plate, available in most outlines Thru hole design
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Description
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777 Series CSP Devices -  - Sensata Technologies
Attleboro, MA, USA
777 Series CSP Devices
777 Series CSP Devices
Open top chip scale package and fine pitch BGA's Accommodates pitch sizes of 0.65mm, 0.75mm, and 0.8mm Compact size and low actuation force 4-Point pitch contact design for enhanced electrical contact Unique mechanism to eliminate solder ball sticking Field replaceable package location plate, available in most outlines Thru hole design
  • Open top chip scale package and fine pitch BGA's
  • Accommodates pitch sizes of 0.65mm, 0.75mm, and 0.8mm
  • Compact size and low actuation force
  • 4-Point pitch contact design for enhanced electrical contact
  • Unique mechanism to eliminate solder ball sticking
  • Field replaceable package location plate, available in most outlines
  • Thru hole design
Supplier's Site Datasheet

Technical Specifications

  Sensata Technologies
Product Category IC Interconnect Components
Product Name 777 Series CSP Devices
Product Type IC Socket
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