Integrated Device Technology Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3218BI1D ES

Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet
Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces - ZSSC3218BI1D ES - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces
ZSSC3218BI1D ES
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3218BI1D ES
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site
Sensor and Detector Interfaces - ZSSC3218BI1D ES - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Sensor and Detector Interfaces
ZSSC3218BI1D ES
Sensor and Detector Interfaces ZSSC3218BI1D ES
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Buy Now Datasheet

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd.
Product Category IC Interfaces IC Interfaces
Product Number ZSSC3218BI1D ES ZSSC3218BI1D ES
Product Name Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces Sensor and Detector Interfaces
Device Type Sensor Interface Storage Interface
Unlock Full Specs
to access all available technical data

Similar Products

Specs
Device Type Receiver; Buffer
Supply Voltage Other
# of Devices 1 #
View Details
 - 74ABT245D,602 - Rochester Electronics
Specs
Device Type Transceiver
Features RoHS
Package Type SO20
View Details
2 suppliers
Type 38.21 - Timed interface modules - EMR & SSR - 382102409024 - Finder S.p.A. con unico socio
Specs
Device Type Sensor Interface
View Details
Interface module - 289-448 - WAGO
Specs
Device Type Sensor Interface
Operating Temperature -20 to 50 C (-4 to 122 F)
View Details