Integrated Device Technology Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3170FE1C

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DICE (WAFER SAWN) - FRAME
  • Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces - ZSSC3170FE1C - Acme Chip Technology Co., Limited
    Acme Chip Technology Co., Limited
  • Sensor and Detector Interfaces - ZSSC3170FE1C - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
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Description
DICE (WAFER SAWN) - FRAME
Datasheet

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Supplier Links
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces - ZSSC3170FE1C - Acme Chip Technology Co., Limited
Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces
ZSSC3170FE1C
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3170FE1C
DICE (WAFER SAWN) - FRAME

DICE (WAFER SAWN) - FRAME

Supplier's Site
Sensor and Detector Interfaces - ZSSC3170FE1C - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Sensor and Detector Interfaces
ZSSC3170FE1C
Sensor and Detector Interfaces ZSSC3170FE1C
DICE (WAFER SAWN) - FRAME

DICE (WAFER SAWN) - FRAME

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Technical Specifications

  Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category IC Interfaces IC Interfaces
Product Number ZSSC3170FE1C ZSSC3170FE1C
Product Name Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces Sensor and Detector Interfaces
Device Type Sensor Interface Storage Interface
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