DICE (WAFER SAWN) - WAFFLE PACK
DICE (WAFER SAWN) - WAFFLE PACK
| Quarktwin Technology Ltd. | Shenzhen Shengyu Electronics Technology Limited | |
|---|---|---|
| Product Category | IC Interfaces | IC Interfaces |
| Product Number | ZSSC3170EE1D | ZSSC3170EE1D |
| Product Name | Sensor and Detector Interfaces | Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces |
| Device Type | Storage Interface | Sensor Interface |
