Integrated Device Technology Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3170EE1D

Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet
Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces - ZSSC3170EE1D - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces
ZSSC3170EE1D
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3170EE1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site
Sensor and Detector Interfaces - ZSSC3170EE1D - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Sensor and Detector Interfaces
ZSSC3170EE1D
Sensor and Detector Interfaces ZSSC3170EE1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Buy Now Datasheet

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd.
Product Category IC Interfaces IC Interfaces
Product Number ZSSC3170EE1D ZSSC3170EE1D
Product Name Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces Sensor and Detector Interfaces
Device Type Sensor Interface Storage Interface
Unlock Full Specs
to access all available technical data

Similar Products

Display Drivers - 296-DLPC3421ZVB-ND - DigiKey
Specs
Technology SPI; I2C
Supply Voltage Other; 1.045V ~ 1.155V, 1.64V ~ 1.96V
Operating Temperature -30 to 85 C (-22 to 185 F)
View Details
3 suppliers
Octal buffer/line driver; 3-state - 74ALVC541PW-Q100J - Nexperia B.V.
Specs
Device Type Buffer
Features RoHS
Supply Voltage Other; +4.6
View Details
2 suppliers
Type 38.21 - Timed interface modules - EMR & SSR - 382100480060 - Finder S.p.A. con unico socio
Specs
Device Type Sensor Interface
View Details
Interface module - 289-726 - WAGO
Specs
Device Type Sensor Interface
Operating Temperature -20 to 50 C (-4 to 122 F)
View Details