Integrated Device Technology Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3170EE1D

Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet
Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces - ZSSC3170EE1D - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces
ZSSC3170EE1D
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3170EE1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site
Sensor and Detector Interfaces - ZSSC3170EE1D - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Sensor and Detector Interfaces
ZSSC3170EE1D
Sensor and Detector Interfaces ZSSC3170EE1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Buy Now Datasheet

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd.
Product Category IC Interfaces IC Interfaces
Product Number ZSSC3170EE1D ZSSC3170EE1D
Product Name Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces Sensor and Detector Interfaces
Device Type Sensor Interface Storage Interface
Unlock Full Specs
to access all available technical data

Similar Products

RF Front End (LNA + PA) - 2312-QPM2637TR7TR-ND - DigiKey
Specs
Device Type Front End
Package Type 28-SMD Module
Pins 28 #
View Details
Type 38.21 - Timed interface modules - EMR & SSR - 382100600060 - Finder S.p.A. con unico socio
Specs
Device Type Sensor Interface
View Details
Interface - Sensor and Detector Interfaces - AD693AD - Lingto Electronic Limited
Specs
Device Type Sensor Interface
View Details
Pressure Sensor Interface With Polynomial Compensation And Diagnostics - A17700LESBTR-DO - Allegro MicroSystems Inc.
Specs
Features RoHS
Package Type QFNL; 24-Pin QFN
Pins 24 #
View Details
7 suppliers