DICE (WAFER SAWN) - WAFFLE PACK
DICE (WAFER SAWN) - WAFFLE PACK
| Acme Chip Technology Co., Limited | Quarktwin Technology Ltd. | |
|---|---|---|
| Product Category | IC Interfaces | IC Interfaces |
| Product Number | ZSSC3135BE1D | ZSSC3135BE1D |
| Product Name | Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces | Sensor and Detector Interfaces |
| Device Type | Sensor Interface | Storage Interface |
