Integrated Device Technology Sensor and Detector Interfaces ZSSC3026CC6C

Description
DICE (WAFER SAWN) - FRAME
Datasheet
Description
DICE (WAFER SAWN) - FRAME
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Sensor and Detector Interfaces - ZSSC3026CC6C - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Sensor and Detector Interfaces
ZSSC3026CC6C
Sensor and Detector Interfaces ZSSC3026CC6C
DICE (WAFER SAWN) - FRAME

DICE (WAFER SAWN) - FRAME

Buy Now Datasheet
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces - ZSSC3026CC6C - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces
ZSSC3026CC6C
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3026CC6C
DICE (WAFER SAWN) - FRAME

DICE (WAFER SAWN) - FRAME

Supplier's Site

Technical Specifications

  Quarktwin Technology Ltd. Acme Chip Technology Co., Limited
Product Category IC Interfaces IC Interfaces
Product Number ZSSC3026CC6C ZSSC3026CC6C
Product Name Sensor and Detector Interfaces Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces
Device Type Storage Interface Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

Type 38.21 - Timed interface modules - EMR & SSR - 382100600060 - Finder S.p.A. con unico socio
Specs
Device Type Sensor Interface
View Details
RF Front End (LNA + PA) - 2312-QPF4506TR13-5KTR-ND - DigiKey
Specs
Device Type Front End
Package Type 16-QFN Exposed Pad
Pins 16 #
View Details
Serial interface - Serial Interface RS-232 C - 750-650/000-006 - WAGO
Specs
Device Type Sensor Interface
Operating Temperature 0 to 55 C (32 to 131 F)
View Details