Integrated Device Technology Sensor and Detector Interfaces ZSSC3018BA2D ES

Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet
Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Sensor and Detector Interfaces - ZSSC3018BA2D ES - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Sensor and Detector Interfaces
ZSSC3018BA2D ES
Sensor and Detector Interfaces ZSSC3018BA2D ES
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Buy Now Datasheet
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces - ZSSC3018BA2D ES - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces
ZSSC3018BA2D ES
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3018BA2D ES
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site

Technical Specifications

  Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited
Product Category IC Interfaces IC Interfaces
Product Number ZSSC3018BA2D ES ZSSC3018BA2D ES
Product Name Sensor and Detector Interfaces Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces
Device Type Storage Interface Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

RF Front End (LNA + PA) - 2312-QPF4658TR13TR-ND - DigiKey
Specs
Device Type Front End
Package Type 24-SMD Module
Pins 24 #
View Details
Type 38.21 - Timed interface modules - EMR & SSR - 382101250060 - Finder S.p.A. con unico socio
Specs
Device Type Sensor Interface
View Details
Interface - Specialized - 73S8014RN-IL/F - Lingto Electronic Limited
Specs
Device Type Sensor Interface
Package Type SOIC; 20-SOIC
View Details