CoM10.6 Dual Interface Module
Build with innovative Coil on Module technology from Infineon to connect the module and the card antenna:
eliminates the galvanic connection process
simplifies the production
improves the production yield
improves the mechanical robustness
dedicated for 10 years life time applications
Moreover the reduced module thickness provides an unknown flexibility in the card construction.
Coil on Module demonstrates Infineon's technology leadership based on extensive semiconductor and module expertise as well as profound understanding of card manufacturer’s systems and requirements.
CoM10.6 Dual Interface Module
Build with innovative Coil on Module technology from Infineon to connect the module and the card antenna:
- eliminates the galvanic connection process
- simplifies the production
- improves the production yield
- improves the mechanical robustness
- dedicated for 10 years life time applications
Moreover the reduced module thickness provides an unknown flexibility in the card construction.
Coil on Module demonstrates Infineon's technology leadership based on extensive semiconductor and module expertise as well as profound understanding of card manufacturer’s systems and requirements.
