Infineon's 600 V SJ MOSFET in bottom-side cooled package minimizes conduction losses and enables standardized cooling and mounting of the device
The 600 V CoolMOS™ S7 SJ MOSFET family is optimized for low conduction losses and features the lowest RDS(on) in the market when it comes to high-voltage SJ MOSFETs in a compact SMD package. It comes with an unprecedented RDS(on) x price figure of merit and is a perfect fit for solid-state circuit breakers and relays, PLCs, battery protection, and active bridge rectification in high-power power supplies. The bottom-side cooled package minimizes conduction losses and enables standardized cooling and mounting of the device.
Summary of Features
Compact bottom-side-cooled QDPAK package
Optimized for conduction performance
Improved thermal resistance
High pulse current capability
Kelvin-source pin improves switching performance at high current
Benefits
Minimizes conduction losses
Increases energy efficiency
More compact and easier designs
Eliminates or reduces heat sinks in solid-state design
Lower TCO cost or BOM cost
Potential Applications
SMPS
Solar energy systems
Battery and equipment protection
Solid state relays (SSR) and solid state circuit breakers (SSCB)
Indoor commercial lighting control
UPS
Low speed electric vehicles (LSEV)
Programmable logic controllers (PLC)
Room air conditioning
Infineon's 600 V SJ MOSFET in bottom-side cooled package minimizes conduction losses and enables standardized cooling and mounting of the device
The 600 V CoolMOS™ S7 SJ MOSFET family is optimized for low conduction losses and features the lowest RDS(on) in the market when it comes to high-voltage SJ MOSFETs in a compact SMD package. It comes with an unprecedented RDS(on) x price figure of merit and is a perfect fit for solid-state circuit breakers and relays, PLCs, battery protection, and active bridge rectification in high-power power supplies. The bottom-side cooled package minimizes conduction losses and enables standardized cooling and mounting of the device.
Summary of Features
- Compact bottom-side-cooled QDPAK package
- Optimized for conduction performance
- Improved thermal resistance
- High pulse current capability
- Kelvin-source pin improves switching performance at high current
Benefits
- Minimizes conduction losses
- Increases energy efficiency
- More compact and easier designs
- Eliminates or reduces heat sinks in solid-state design
- Lower TCO cost or BOM cost
Potential Applications
- SMPS
- Solar energy systems
- Battery and equipment protection
- Solid state relays (SSR) and solid state circuit breakers (SSCB)
- Indoor commercial lighting control
- UPS
- Low speed electric vehicles (LSEV)
- Programmable logic controllers (PLC)
- Room air conditioning
