Infineon Technologies AG 500V-950V N-Channel Power MOSFET IPDD60R102G7

Description
Double DPAK (D-DPAK) Innovative top-side cooled SMD solution for high power applications Infineon Technologies introduces Double DPAK (D-DPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology 600 V CoolMOS™ G7 superjunction (SJ) MOSFET is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies. Summary of Features Gives best-in-class FOM RDS(on) x Eoss and RDS(on) x Qg Innovative top-side cooling concept Inbuilt 4th pin Kelvin source configuration and low parasitic source inductance TCOB capability of >> 2.000 cycles, MSL1 compliant and total Pb-free Benefits Enabling highest energy efficiency Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits Reduced parasitic source inductance improves e iciency and ease-of-use Enables higher power density solutions Exceeding the highest quality standards Potential Applications Telecom Server Solar PC power SMPS Applications DIN rail power supplies Uninterruptible power supplies (UPS)
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Description
Double DPAK (D-DPAK) Innovative top-side cooled SMD solution for high power applications Infineon Technologies introduces Double DPAK (D-DPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology 600 V CoolMOS™ G7 superjunction (SJ) MOSFET is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies. Summary of Features Gives best-in-class FOM RDS(on) x Eoss and RDS(on) x Qg Innovative top-side cooling concept Inbuilt 4th pin Kelvin source configuration and low parasitic source inductance TCOB capability of >> 2.000 cycles, MSL1 compliant and total Pb-free Benefits Enabling highest energy efficiency Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits Reduced parasitic source inductance improves e iciency and ease-of-use Enables higher power density solutions Exceeding the highest quality standards Potential Applications Telecom Server Solar PC power SMPS Applications DIN rail power supplies Uninterruptible power supplies (UPS)
Request a Quote
Datasheet
Datasheet Summary
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The IPDD60R102G7 is a 600V CoolMOS™ G7 superjunction MOSFET in a PG-HDSOP-10 package with a 115mm² footprint, designed for high-efficiency power factor correction and LLC resonant converter applications. It features a 4-pin Kelvin source configuration to reduce parasitic source inductance (~3nH) and improved thermal performance with a junction-to-case thermal resistance of 0.9°C/W. The device has a maximum continuous drain current of 32A at TJ<150°C, an on-state resistance of 102mΩ at 25°C, a total gate charge of 34nC, and a peak pulsed drain current of 66A. It is fully qualified according to JEDEC for industrial applications, MSL1 compliant, and Pb-free. The package supports solder reflow up to 260°C and is suitable for high-current SMD designs up to 3kW.

Datasheet Summary
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The IPDD60R102G7 is a 600V CoolMOS™ G7 superjunction MOSFET in a PG-HDSOP-10 package with a 115mm² footprint, designed for high-efficiency power factor correction and LLC resonant converter applications. It features a 4-pin Kelvin source configuration to reduce parasitic source inductance (~3nH) and improved thermal performance with a junction-to-case thermal resistance of 0.9°C/W. The device has a maximum continuous drain current of 32A at TJ<150°C, an on-state resistance of 102mΩ at 25°C, a total gate charge of 34nC, and a peak pulsed drain current of 66A. It is fully qualified according to JEDEC for industrial applications, MSL1 compliant, and Pb-free. The package supports solder reflow up to 260°C and is suitable for high-current SMD designs up to 3kW.

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Supplier Links
500V-950V N-Channel Power MOSFET - IPDD60R102G7 - Infineon Technologies AG
Neubiberg, Germany
500V-950V N-Channel Power MOSFET
IPDD60R102G7
500V-950V N-Channel Power MOSFET IPDD60R102G7
Double DPAK (D-DPAK) Innovative top-side cooled SMD solution for high power applications Infineon Technologies introduces Double DPAK (D-DPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology 600 V CoolMOS™ G7 superjunction (SJ) MOSFET is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies. Summary of Features Gives best-in-class FOM RDS(on) x Eoss and RDS(on) x Qg Innovative top-side cooling concept Inbuilt 4th pin Kelvin source configuration and low parasitic source inductance TCOB capability of >> 2.000 cycles, MSL1 compliant and total Pb-free Benefits Enabling highest energy efficiency Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits Reduced parasitic source inductance improves e iciency and ease-of-use Enables higher power density solutions Exceeding the highest quality standards Potential Applications Telecom Server Solar PC power SMPS Applications DIN rail power supplies Uninterruptible power supplies (UPS)

Double DPAK (D-DPAK) Innovative top-side cooled SMD solution for high power applications

Infineon Technologies introduces Double DPAK (D-DPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom.

The benefits of the already existing high voltage technology 600 V CoolMOS™ G7 superjunction (SJ) MOSFET is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.


Summary of Features

  • Gives best-in-class FOM RDS(on) x Eoss and RDS(on) x Qg
  • Innovative top-side cooling concept
  • Inbuilt 4th pin Kelvin source configuration and low parasitic source inductance
  • TCOB capability of >> 2.000 cycles, MSL1 compliant and total Pb-free

Benefits

  • Enabling highest energy efficiency
  • Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
  • Reduced parasitic source inductance improves e iciency and ease-of-use
  • Enables higher power density solutions
  • Exceeding the highest quality standards

Potential Applications

  • Telecom
  • Server
  • Solar
  • PC power
  • SMPS

Applications

  • DIN rail power supplies
  • Uninterruptible power supplies (UPS)
Supplier's Site Datasheet

Technical Specifications

  Infineon Technologies AG
Product Category Power MOSFET
Product Number IPDD60R102G7
Product Name 500V-950V N-Channel Power MOSFET
Polarity N-Channel; N
Transistor Technology / Material Si/SiC
rDS(on) 0.1020 ohms
QG 34 nC
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