Double DPAK (D-DPAK) Innovative top-side cooled SMD solution for high power applications
Infineon Technologies introduces Double DPAK (D-DPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom.
The benefits of the already existing high voltage technology 600 V CoolMOS™ G7 superjunction (SJ) MOSFET is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
Summary of Features
Gives best-in-class FOM RDS(on) x Eoss and RDS(on) x Qg
Innovative top-side cooling concept
Inbuilt 4th pin Kelvin source configuration and low parasitic source inductance
TCOB capability of >> 2.000 cycles, MSL1 compliant and total Pb-free
Benefits
Enabling highest energy efficiency
Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
Reduced parasitic source inductance improves e iciency and ease-of-use
Enables higher power density solutions
Exceeding the highest quality standards
Potential Applications
Telecom
Server
Solar
PC power
SMPS
Applications
48 V intermediate bus converter (IBC)
Automotive secondary power distribution unit
DIN rail power supplies
Power transmission and distribution
Double DPAK (D-DPAK) Innovative top-side cooled SMD solution for high power applications
Infineon Technologies introduces Double DPAK (D-DPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom.
The benefits of the already existing high voltage technology 600 V CoolMOS™ G7 superjunction (SJ) MOSFET is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
Summary of Features
- Gives best-in-class FOM RDS(on) x Eoss and RDS(on) x Qg
- Innovative top-side cooling concept
- Inbuilt 4th pin Kelvin source configuration and low parasitic source inductance
- TCOB capability of >> 2.000 cycles, MSL1 compliant and total Pb-free
Benefits
- Enabling highest energy efficiency
- Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
- Reduced parasitic source inductance improves e iciency and ease-of-use
- Enables higher power density solutions
- Exceeding the highest quality standards
Potential Applications
- Telecom
- Server
- Solar
- PC power
- SMPS
Applications
- 48 V intermediate bus converter (IBC)
- Automotive secondary power distribution unit
- DIN rail power supplies
- Power transmission and distribution
