Infineon Technologies AG Single FETs, MOSFETs IPC302NE7N3X1SA1

Description
MOSFET N-CH 75V 1A SAWN ON FOIL
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Description
MOSFET N-CH 75V 1A SAWN ON FOIL
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Datasheet
Datasheet Summary
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N-channel enhancement mode MOSFET bare die for power applications, with a drain-source breakdown voltage of 75 V, a typical drain-source on-resistance of 1.2 mΩ at V_GS=10 V, and a die size of 6.7 x 4.5 mm². The device is supplied as a sawn-on-foil chip with backside metallization of NiV and frontside metallization of AlCu, and is classified as electrostatic discharge sensitive per MIL-STD-883C.

Datasheet Summary
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N-channel enhancement mode MOSFET bare die for power applications, with a drain-source breakdown voltage of 75 V, a typical drain-source on-resistance of 1.2 mΩ at V_GS=10 V, and a die size of 6.7 x 4.5 mm². The device is supplied as a sawn-on-foil chip with backside metallization of NiV and frontside metallization of AlCu, and is classified as electrostatic discharge sensitive per MIL-STD-883C.

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Single FETs, MOSFETs - 448-IPC302NE7N3X1SA1-ND - DigiKey
Thief River Falls, MN, United States
Single FETs, MOSFETs
448-IPC302NE7N3X1SA1-ND
Single FETs, MOSFETs 448-IPC302NE7N3X1SA1-ND
MOSFET N-CH 75V 1A SAWN ON FOIL

MOSFET N-CH 75V 1A SAWN ON FOIL

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Technical Specifications

  DigiKey
Product Category Transistors
Product Number 448-IPC302NE7N3X1SA1-ND
Product Name Single FETs, MOSFETs
Polarity N-Channel
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