MIPAQ™ base 1700V sixpack IGBT Module with Trench/Fieldstop IGBT4, current sense shunts, Emitter controlled Diode, NTC, PressFIT and pre applied Thermal Interface Material.
Summary of Features
High Power and Thermal Cycling Capability
Available in the well-proven EconoPACK™ 3 housing
Pre-applied Thermal Interface Material
Sixpack configuration with shunts and NTC
PressFIT Contact Technology
Allows accurate current sensing
Up to 150 A nominal current
150 °C operation junction temperature
Excellent power cycling capability
Benefits
Excellent performance with regard to system cost
High power density for compact inverter designs
Standardized housing
Saves space and system cost
Potential Applications
Motor control and drives
Uninterruptible power supply (UPS)
Wind energy systems
Solutions for solar energy systems
MIPAQ™ base 1700V sixpack IGBT Module with Trench/Fieldstop IGBT4, current sense shunts, Emitter controlled Diode, NTC, PressFIT and pre applied Thermal Interface Material.
Summary of Features
- High Power and Thermal Cycling Capability
- Available in the well-proven EconoPACK™ 3 housing
- Pre-applied Thermal Interface Material
- Sixpack configuration with shunts and NTC
- PressFIT Contact Technology
- Allows accurate current sensing
- Up to 150 A nominal current
- 150 °C operation junction temperature
- Excellent power cycling capability
Benefits
- Excellent performance with regard to system cost
- High power density for compact inverter designs
- Standardized housing
- Saves space and system cost
Potential Applications
- Motor control and drives
- Uninterruptible power supply (UPS)
- Wind energy systems
- Solutions for solar energy systems
