The FS820R08A6P2B is a HybridPACK™ Drive module designed for automotive hybrid and electric vehicle applications, featuring an EDT2 IGBT and diode in a six-pack configuration with a 750 V blocking voltage and 820 A implemented collector current. It operates with a maximum junction temperature of 175°C and employs a direct-cooled PinFin baseplate for superior thermal performance. The module includes press-fit signal terminals, an integrated NTC thermistor, and complies with RoHS and UL 94 V-0 standards. It has a 4.2 kV DC insulation rating, 9.0 mm creepage, and 4.5 mm clearance. The dimensions are 104.25 mm × 82 mm × 22.25 mm, with a weight of 720 g.
HybridPACK Drive module with EDT2 IGBT and Diode
| Rochester Electronics | |
|---|---|
| Product Category | Insulated Gate Bipolar Transistors (IGBT) |
| Product Number | FS820R08A6P2BS8BPSA1 |
| Package Type | AG-HYBRIDD-1-1 |
