Infineon Technologies AG Power - IGBT - Automotive-qualified IGBTs - Automotive IGBT and CoolSiC™ MOSFET modules - FS820R08A6P2 FS820R08A6P2

Description
The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The direct cooled baseplate with PinFin structure in the FS820R08A6P2 product best utilizes the implemented chipset and shows superior thermal characteristics. Summary of Features Blocking voltage 750V Low VCEsat Low Switching Losses Low Qg and Cres Low Inductive Design Tvj op = 150°C Short-time extended Operation Temperature Tvj op = 175°C Benefits Compact Design Direct Cooled Base Plate Integrated NTC temperature sensor PressFIT Contact Technology RoHS compliant Mechanical guiding elements Potential Applications Automotive Applications Hybrid Electrical Vehicles (H)EV Motor Drives Commercial Agriculture Vehicles Applications EV traction inverter
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Description
The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The direct cooled baseplate with PinFin structure in the FS820R08A6P2 product best utilizes the implemented chipset and shows superior thermal characteristics. Summary of Features Blocking voltage 750V Low VCEsat Low Switching Losses Low Qg and Cres Low Inductive Design Tvj op = 150°C Short-time extended Operation Temperature Tvj op = 175°C Benefits Compact Design Direct Cooled Base Plate Integrated NTC temperature sensor PressFIT Contact Technology RoHS compliant Mechanical guiding elements Potential Applications Automotive Applications Hybrid Electrical Vehicles (H)EV Motor Drives Commercial Agriculture Vehicles Applications EV traction inverter
Request a Quote
Datasheet
Datasheet Summary
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The FS820R08A6P2 is an automotive-qualified HybridPACK Drive power module for hybrid and electric vehicle traction inverters, featuring a six-pack configuration with EDT2 IGBTs and diodes rated for 750 V blocking voltage and 820 A collector current. It employs a direct-cooled PinFin baseplate for superior thermal performance, with a maximum junction operating temperature of 175°C and a thermal resistance from junction to cooling fluid of 0.175-0.200 K/W per diode. The module includes an integrated NTC thermistor, press-fit signal terminals, and mechanical guiding elements for assembly. It measures 104.25 mm × 59.12 mm × 18.85 mm and weighs 720 g, with 4.2 kV DC isolation, 9.0 mm creepage, and 4.5 mm clearance. The package is RoHS compliant and meets UL 94 V-0 flammability standards.

Datasheet Summary
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The FS820R08A6P2 is an automotive-qualified HybridPACK Drive power module for hybrid and electric vehicle traction inverters, featuring a six-pack configuration with EDT2 IGBTs and diodes rated for 750 V blocking voltage and 820 A collector current. It employs a direct-cooled PinFin baseplate for superior thermal performance, with a maximum junction operating temperature of 175°C and a thermal resistance from junction to cooling fluid of 0.175-0.200 K/W per diode. The module includes an integrated NTC thermistor, press-fit signal terminals, and mechanical guiding elements for assembly. It measures 104.25 mm × 59.12 mm × 18.85 mm and weighs 720 g, with 4.2 kV DC isolation, 9.0 mm creepage, and 4.5 mm clearance. The package is RoHS compliant and meets UL 94 V-0 flammability standards.

Suppliers

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Supplier Links
Power - IGBT - Automotive-qualified IGBTs - Automotive IGBT and CoolSiC™ MOSFET modules - FS820R08A6P2 - FS820R08A6P2 - Infineon Technologies AG
Neubiberg, Germany
Power - IGBT - Automotive-qualified IGBTs - Automotive IGBT and CoolSiC™ MOSFET modules - FS820R08A6P2
FS820R08A6P2
Power - IGBT - Automotive-qualified IGBTs - Automotive IGBT and CoolSiC™ MOSFET modules - FS820R08A6P2 FS820R08A6P2
The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The direct cooled baseplate with PinFin structure in the FS820R08A6P2 product best utilizes the implemented chipset and shows superior thermal characteristics. Summary of Features Blocking voltage 750V Low VCEsat Low Switching Losses Low Qg and Cres Low Inductive Design Tvj op = 150°C Short-time extended Operation Temperature Tvj op = 175°C Benefits Compact Design Direct Cooled Base Plate Integrated NTC temperature sensor PressFIT Contact Technology RoHS compliant Mechanical guiding elements Potential Applications Automotive Applications Hybrid Electrical Vehicles (H)EV Motor Drives Commercial Agriculture Vehicles Applications EV traction inverter

The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The direct cooled baseplate with PinFin structure in the FS820R08A6P2 product best utilizes the implemented chipset and shows superior thermal characteristics.


Summary of Features

  • Blocking voltage 750V
  • Low VCEsat
  • Low Switching Losses
  • Low Qg and Cres
  • Low Inductive Design
  • Tvj op = 150°C
  • Short-time extended Operation Temperature Tvj op = 175°C

Benefits

  • Compact Design
  • Direct Cooled Base Plate
  • Integrated NTC temperature sensor
  • PressFIT Contact Technology
  • RoHS compliant
  • Mechanical guiding elements

Potential Applications

  • Automotive Applications
  • Hybrid Electrical Vehicles (H)EV
  • Motor Drives
  • Commercial Agriculture Vehicles

Applications

  • EV traction inverter
Supplier's Site Datasheet

Technical Specifications

  Infineon Technologies AG
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number FS820R08A6P2
Product Name Power - IGBT - Automotive-qualified IGBTs - Automotive IGBT and CoolSiC™ MOSFET modules - FS820R08A6P2
VCES 750 volts
VCE(on) 1.1 volts
IC(max) 1640 amps
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