The power module implements the second generation CoolSiC™ Automotive MOSFET 1200V, optimized for electric drive train applications, from mid- to high-range automotive power classes to high-range commercial, construction, and agricultural vehicles.
Summary of Features
New semicond. material - silicon carbide
Low RDS(on)
Low switching losses
Low Qg and Crss
4.2 kV DC 1 second insulation
High creepage and clearance distances
Compact design
High power density
Direct-cooled PinFin base plate
High-performance Si3N4 ceramic
PCB and cooler assembly guidelines
Integrated temperature sensing diode
Benefits
Higher temperature cycling capability
Integrated diode temperature sensors
New plastic material
Better temperature capability
Lower system BOM
Lower AC contact resistance
Lower tab temperature
PressFIT Contact Technology
RoHS compliant
Completely Pb free
Superior reliability
Potential Applications
Automotive applications
(Hybrid) electrical vehicles (H)EV
Motor drives
Commercial, construction and agricultural vehicles (CAV)
Designers who used this product also designed with
1EDI3031AS | Gate driver ICs
TLF80511EJ V33 | OPTIREG™ linear voltage regulators (LDO)
TLF35584QVVS1 | OPTIREG™ PMIC
TLE8386-2EL | OPTIREG™ switcher
TLE9250LE | Automotive CAN transceivers
1EDI3030AS | Gate driver ICs
SAK-TC389QP-160F300S AE AURIX™ Family – TC38xQP
1EDI3031AS | Gate driver ICs
TLF80511EJ V33 | OPTIREG™ linear voltage regulators (LDO)
TLF35584QVVS1 | OPTIREG™ PMIC
TLE8386-2EL | OPTIREG™ switcher
TLE9250LE | Automotive CAN transceivers
1EDI3030AS | Gate driver ICs
SAK-TC389QP-160F300S AE AURIX™ Family – TC38xQP
1EDI3031AS | Gate driver ICs
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The power module implements the second generation CoolSiC™ Automotive MOSFET 1200V, optimized for electric drive train applications, from mid- to high-range automotive power classes to high-range commercial, construction, and agricultural vehicles.
Summary of Features
- New semicond. material - silicon carbide
- Low RDS(on)
- Low switching losses
- Low Qg and Crss
- 4.2 kV DC 1 second insulation
- High creepage and clearance distances
- Compact design
- High power density
- Direct-cooled PinFin base plate
- High-performance Si3N4 ceramic
- PCB and cooler assembly guidelines
- Integrated temperature sensing diode
Benefits
- Higher temperature cycling capability
- Integrated diode temperature sensors
- New plastic material
- Better temperature capability
- Lower system BOM
- Lower AC contact resistance
- Lower tab temperature
- PressFIT Contact Technology
- RoHS compliant
- Completely Pb free
- Superior reliability
Potential Applications
- Automotive applications
- (Hybrid) electrical vehicles (H)EV
- Motor drives
- Commercial, construction and agricultural vehicles (CAV)
Designers who used this product also designed with
- 1EDI3031AS |
Gate driver ICs
- TLF80511EJ V33 |
OPTIREG™ linear voltage regulators (LDO)
- TLF35584QVVS1 |
OPTIREG™ PMIC
- TLE8386-2EL |
OPTIREG™ switcher
- TLE9250LE |
Automotive CAN transceivers
- 1EDI3030AS |
Gate driver ICs
- SAK-TC389QP-160F300S AE
AURIX™ Family – TC38xQP
- 1EDI3031AS |
Gate driver ICs
- TLF80511EJ V33 |
OPTIREG™ linear voltage regulators (LDO)
- TLF35584QVVS1 |
OPTIREG™ PMIC
- TLE8386-2EL |
OPTIREG™ switcher
- TLE9250LE |
Automotive CAN transceivers
- 1EDI3030AS |
Gate driver ICs
- SAK-TC389QP-160F300S AE
AURIX™ Family – TC38xQP
- 1EDI3031AS |
Gate driver ICs
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