Infineon Technologies AG Power - IGBT - Automotive-qualified IGBTs - Automotive IGBT and CoolSiC™ MOSFET modules - FF450R08A03P2 FF450R08A03P2

Description
The HybridPACKTM DSC S2 is a very compact half-bridge module targeting Hybrid- and Electric Vehicle applications. The module is based on Infineon’s long-term experience developing IGBT power modules and implements the EDT2 IGBT generation. The innovative and small package is designed for Double Sided Cooling (DSC) with superior thermal performance and enables highest power density. It targets main inverters with power up to 75 kW. Summary of Features On-chip Current Sensor On-chip Temperature Sensor Low Inductive Design Blocking voltage 750V Low Switching Losses Short-time extended Operation Temperature Tvj op = 175°C Full automotive qualification according to AQG324 Benefits Superior thermal performance Very compact and light power module for achieving highest power density Enables high inverter efficiency through EDT2 IGBT technology with on-chip sensors Optimized for automotive applications with DC link voltages up to 450 V and gate driver voltage level of -8 V / +15 V Potential Applications Automotive Applications Hybrid Electrical Vehicles (H)EV Applications EV charging EV traction inverter Transfer case brushless DC (BLDC)
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Description
The HybridPACKTM DSC S2 is a very compact half-bridge module targeting Hybrid- and Electric Vehicle applications. The module is based on Infineon’s long-term experience developing IGBT power modules and implements the EDT2 IGBT generation. The innovative and small package is designed for Double Sided Cooling (DSC) with superior thermal performance and enables highest power density. It targets main inverters with power up to 75 kW. Summary of Features On-chip Current Sensor On-chip Temperature Sensor Low Inductive Design Blocking voltage 750V Low Switching Losses Short-time extended Operation Temperature Tvj op = 175°C Full automotive qualification according to AQG324 Benefits Superior thermal performance Very compact and light power module for achieving highest power density Enables high inverter efficiency through EDT2 IGBT technology with on-chip sensors Optimized for automotive applications with DC link voltages up to 450 V and gate driver voltage level of -8 V / +15 V Potential Applications Automotive Applications Hybrid Electrical Vehicles (H)EV Applications EV charging EV traction inverter Transfer case brushless DC (BLDC)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Power - IGBT - Automotive-qualified IGBTs - Automotive IGBT and CoolSiC™ MOSFET modules - FF450R08A03P2 - FF450R08A03P2 - Infineon Technologies AG
Neubiberg, Germany
Power - IGBT - Automotive-qualified IGBTs - Automotive IGBT and CoolSiC™ MOSFET modules - FF450R08A03P2
FF450R08A03P2
Power - IGBT - Automotive-qualified IGBTs - Automotive IGBT and CoolSiC™ MOSFET modules - FF450R08A03P2 FF450R08A03P2
The HybridPACKTM DSC S2 is a very compact half-bridge module targeting Hybrid- and Electric Vehicle applications. The module is based on Infineon’s long-term experience developing IGBT power modules and implements the EDT2 IGBT generation. The innovative and small package is designed for Double Sided Cooling (DSC) with superior thermal performance and enables highest power density. It targets main inverters with power up to 75 kW. Summary of Features On-chip Current Sensor On-chip Temperature Sensor Low Inductive Design Blocking voltage 750V Low Switching Losses Short-time extended Operation Temperature Tvj op = 175°C Full automotive qualification according to AQG324 Benefits Superior thermal performance Very compact and light power module for achieving highest power density Enables high inverter efficiency through EDT2 IGBT technology with on-chip sensors Optimized for automotive applications with DC link voltages up to 450 V and gate driver voltage level of -8 V / +15 V Potential Applications Automotive Applications Hybrid Electrical Vehicles (H)EV Applications EV charging EV traction inverter Transfer case brushless DC (BLDC)

The HybridPACKTM DSC S2 is a very compact half-bridge module targeting Hybrid- and Electric Vehicle applications. The module is based on Infineon’s long-term experience developing IGBT power modules and implements the EDT2 IGBT generation. The innovative and small package is designed for Double Sided Cooling (DSC) with superior thermal performance and enables highest power density. It targets main inverters with power up to 75 kW.


Summary of Features

  • On-chip Current Sensor
  • On-chip Temperature Sensor
  • Low Inductive Design
  • Blocking voltage 750V
  • Low Switching Losses
  • Short-time extended Operation Temperature Tvj op = 175°C
  • Full automotive qualification according to AQG324

Benefits

  • Superior thermal performance
  • Very compact and light power module for achieving highest power density
  • Enables high inverter efficiency through EDT2 IGBT technology with on-chip sensors
  • Optimized for automotive applications with DC link voltages up to 450 V and gate driver voltage level of -8 V / +15 V

Potential Applications

  • Automotive Applications
  • Hybrid Electrical Vehicles (H)EV

Applications

  • EV charging
  • EV traction inverter
  • Transfer case brushless DC (BLDC)
Supplier's Site Datasheet

Technical Specifications

  Infineon Technologies AG
Product Category Insulated Gate Bipolar Transistors (IGBT)
Product Number FF450R08A03P2
Product Name Power - IGBT - Automotive-qualified IGBTs - Automotive IGBT and CoolSiC™ MOSFET modules - FF450R08A03P2
VCES 750 volts
VCE(on) 1.2 volts
IC(max) 900 amps
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