Infineon Technologies AG Power - Gate Driver ICs - 2ED1323S12P 2ED1323S12P

Description
EiceDRIVER™ 1200 V high-side/low-side gate driver IC with 2.3 A source, 2.3 A sink current in the sufficient creepage, clearance distance DSO-20 (300mils) package for 1200 V SiC MOSFET and IGBT power devices. The 2ED1323S12P supports Active Miller Clamp (AMC) and Short Circuit Clamp (SCC) for the best in class switching performance in the sufficient creepage/clearance distance package DSO-20. Based on the used SOI-technology there is an excellent ruggedness on transient voltages. Since the device contains no parasitic thyristor structures, the design is very robust against parasitic latch up across the operating temperature and voltage range. Summary of Features Unique Infineon thin-film-Silicon On Insulator (SOI)-technology Floating channel designed for bootstrap operation Maximum bootstrap voltage (VB node) of + 1225 V Operating voltages (VS node) upto + 1200 V Negative VS transient voltage immunity of 100 V with repetitive 700 ns pulses 2.3 A / 2.3 A peak output source / sink current capability Integrated ultra-fast over-current protection (OCP) ± 5% high accuracy reference threshold Less than 1 us over-current sense to output shutdown Integrated Active Miller Clamp (AMC) with 2 A sink current capability Integrated Short Circuit Clamp (SCC) function Integrated ultra-fast, low resistance bootstrap diode Enable, Fault, and programmable Fault clear RFE input Logic operational up to –8 V on VS Pin Independent per channel undervoltage lockout (UVLO) 25 V VCC supply voltage (maximum) Separate Logic (VSS) and output ground (COM) Greater than 5 mm clearance / creepage 2 kV HBM ESD capability Benefits 1200 V High current capability (2.3 A/2.3 A) with Integrated bootstrap diode in tiny foot print provides reduced BOM cost, smaller PCB space at lower cost with simpler design Optimized gate driver solution with design flexibility for 1200V IGBT/SiC based PIM, discrete switch 100 V negative VS increased reliability / robustness 50% lower level shift losses leads lower temperature operation and higher reliability Active Miller Clamp supports very stable switching performance for whole power device, specially the low threshold one ; SiC etc. Short Circuit Clamp removes gate voltage rise at short circuit situation Latch-up immune increased reliability Fast and accurate integrated over-current protection, provides space and cost savings compare to a discrete op-amp component solution while protecting the switches Under-voltage lockout provides protection at low supply voltage Wider Creepage and clearance distance in DSO-20 package Applications Ceiling fan - motor control and drive solutions Heating ventilation and air conditioning (HVAC) Industrial motor drives and controls Residential heat pumps
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Description
EiceDRIVER™ 1200 V high-side/low-side gate driver IC with 2.3 A source, 2.3 A sink current in the sufficient creepage, clearance distance DSO-20 (300mils) package for 1200 V SiC MOSFET and IGBT power devices. The 2ED1323S12P supports Active Miller Clamp (AMC) and Short Circuit Clamp (SCC) for the best in class switching performance in the sufficient creepage/clearance distance package DSO-20. Based on the used SOI-technology there is an excellent ruggedness on transient voltages. Since the device contains no parasitic thyristor structures, the design is very robust against parasitic latch up across the operating temperature and voltage range. Summary of Features Unique Infineon thin-film-Silicon On Insulator (SOI)-technology Floating channel designed for bootstrap operation Maximum bootstrap voltage (VB node) of + 1225 V Operating voltages (VS node) upto + 1200 V Negative VS transient voltage immunity of 100 V with repetitive 700 ns pulses 2.3 A / 2.3 A peak output source / sink current capability Integrated ultra-fast over-current protection (OCP) ± 5% high accuracy reference threshold Less than 1 us over-current sense to output shutdown Integrated Active Miller Clamp (AMC) with 2 A sink current capability Integrated Short Circuit Clamp (SCC) function Integrated ultra-fast, low resistance bootstrap diode Enable, Fault, and programmable Fault clear RFE input Logic operational up to –8 V on VS Pin Independent per channel undervoltage lockout (UVLO) 25 V VCC supply voltage (maximum) Separate Logic (VSS) and output ground (COM) Greater than 5 mm clearance / creepage 2 kV HBM ESD capability Benefits 1200 V High current capability (2.3 A/2.3 A) with Integrated bootstrap diode in tiny foot print provides reduced BOM cost, smaller PCB space at lower cost with simpler design Optimized gate driver solution with design flexibility for 1200V IGBT/SiC based PIM, discrete switch 100 V negative VS increased reliability / robustness 50% lower level shift losses leads lower temperature operation and higher reliability Active Miller Clamp supports very stable switching performance for whole power device, specially the low threshold one ; SiC etc. Short Circuit Clamp removes gate voltage rise at short circuit situation Latch-up immune increased reliability Fast and accurate integrated over-current protection, provides space and cost savings compare to a discrete op-amp component solution while protecting the switches Under-voltage lockout provides protection at low supply voltage Wider Creepage and clearance distance in DSO-20 package Applications Ceiling fan - motor control and drive solutions Heating ventilation and air conditioning (HVAC) Industrial motor drives and controls Residential heat pumps
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Power - Gate Driver ICs - 2ED1323S12P - 2ED1323S12P - Infineon Technologies AG
Neubiberg, Germany
Power - Gate Driver ICs - 2ED1323S12P
2ED1323S12P
Power - Gate Driver ICs - 2ED1323S12P 2ED1323S12P
EiceDRIVER™ 1200 V high-side/low-side gate driver IC with 2.3 A source, 2.3 A sink current in the sufficient creepage, clearance distance DSO-20 (300mils) package for 1200 V SiC MOSFET and IGBT power devices. The 2ED1323S12P supports Active Miller Clamp (AMC) and Short Circuit Clamp (SCC) for the best in class switching performance in the sufficient creepage/clearance distance package DSO-20. Based on the used SOI-technology there is an excellent ruggedness on transient voltages. Since the device contains no parasitic thyristor structures, the design is very robust against parasitic latch up across the operating temperature and voltage range. Summary of Features Unique Infineon thin-film-Silicon On Insulator (SOI)-technology Floating channel designed for bootstrap operation Maximum bootstrap voltage (VB node) of + 1225 V Operating voltages (VS node) upto + 1200 V Negative VS transient voltage immunity of 100 V with repetitive 700 ns pulses 2.3 A / 2.3 A peak output source / sink current capability Integrated ultra-fast over-current protection (OCP) ± 5% high accuracy reference threshold Less than 1 us over-current sense to output shutdown Integrated Active Miller Clamp (AMC) with 2 A sink current capability Integrated Short Circuit Clamp (SCC) function Integrated ultra-fast, low resistance bootstrap diode Enable, Fault, and programmable Fault clear RFE input Logic operational up to –8 V on VS Pin Independent per channel undervoltage lockout (UVLO) 25 V VCC supply voltage (maximum) Separate Logic (VSS) and output ground (COM) Greater than 5 mm clearance / creepage 2 kV HBM ESD capability Benefits 1200 V High current capability (2.3 A/2.3 A) with Integrated bootstrap diode in tiny foot print provides reduced BOM cost, smaller PCB space at lower cost with simpler design Optimized gate driver solution with design flexibility for 1200V IGBT/SiC based PIM, discrete switch 100 V negative VS increased reliability / robustness 50% lower level shift losses leads lower temperature operation and higher reliability Active Miller Clamp supports very stable switching performance for whole power device, specially the low threshold one ; SiC etc. Short Circuit Clamp removes gate voltage rise at short circuit situation Latch-up immune increased reliability Fast and accurate integrated over-current protection, provides space and cost savings compare to a discrete op-amp component solution while protecting the switches Under-voltage lockout provides protection at low supply voltage Wider Creepage and clearance distance in DSO-20 package Applications Ceiling fan - motor control and drive solutions Heating ventilation and air conditioning (HVAC) Industrial motor drives and controls Residential heat pumps

EiceDRIVER™ 1200 V high-side/low-side gate driver IC with 2.3 A source, 2.3 A sink current in the sufficient creepage, clearance distance DSO-20 (300mils) package for 1200 V SiC MOSFET and IGBT power devices. The 2ED1323S12P supports Active Miller Clamp (AMC) and Short Circuit Clamp (SCC) for the best in class switching performance in the sufficient creepage/clearance distance package DSO-20. Based on the used SOI-technology there is an excellent ruggedness on transient voltages. Since the device contains no parasitic thyristor structures, the design is very robust against parasitic latch up across the operating temperature and voltage range.


Summary of Features

  • Unique Infineon thin-film-Silicon On Insulator (SOI)-technology
  • Floating channel designed for bootstrap operation
  • Maximum bootstrap voltage (VB node) of + 1225 V
  • Operating voltages (VS node) upto + 1200 V
  • Negative VS transient voltage immunity of 100 V with repetitive 700 ns pulses
  • 2.3 A / 2.3 A peak output source / sink current capability
  • Integrated ultra-fast over-current protection (OCP)
  • ± 5% high accuracy reference threshold
  • Less than 1 us over-current sense to output shutdown
  • Integrated Active Miller Clamp (AMC) with 2 A sink current capability
  • Integrated Short Circuit Clamp (SCC) function
  • Integrated ultra-fast, low resistance bootstrap diode
  • Enable, Fault, and programmable Fault clear RFE input
  • Logic operational up to –8 V on VS Pin
  • Independent per channel undervoltage lockout (UVLO)
  • 25 V VCC supply voltage (maximum)
  • Separate Logic (VSS) and output ground (COM)
  • Greater than 5 mm clearance / creepage
  • 2 kV HBM ESD capability

Benefits

  • 1200 V High current capability (2.3 A/2.3 A) with Integrated bootstrap diode in tiny foot print provides reduced BOM cost, smaller PCB space at lower cost with simpler design
  • Optimized gate driver solution with design flexibility for 1200V IGBT/SiC based PIM, discrete switch
  • 100 V negative VS increased reliability / robustness
  • 50% lower level shift losses leads lower temperature operation and higher reliability
  • Active Miller Clamp supports very stable switching performance for whole power device, specially the low threshold one ; SiC etc.
  • Short Circuit Clamp removes gate voltage rise at short circuit situation
  • Latch-up immune increased reliability
  • Fast and accurate integrated over-current protection, provides space and cost savings compare to a discrete op-amp component solution while protecting the switches
  • Under-voltage lockout provides protection at low supply voltage
  • Wider Creepage and clearance distance in DSO-20 package

Applications

  • Ceiling fan - motor control and drive solutions
  • Heating ventilation and air conditioning (HVAC)
  • Industrial motor drives and controls
  • Residential heat pumps
Supplier's Site Datasheet

Technical Specifications

  Infineon Technologies AG
Product Category Gate Drivers
Product Number 2ED1323S12P
Product Name Power - Gate Driver ICs - 2ED1323S12P
Driver Type High-side; Low-side
Output Current 2.3 amps
Supply Voltage -1 to 25 volts
Propagation Delay 350 ns
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