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MacDermid Alpha Electronics Solutions ALPHA ® AccuFlux ® BTC-578 Solder Preforms ALPHA® AccuFlux™ BTC-578

Description
Designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components. Product Overview ALPHA AccuFlux BTC-578 technology is a precision controlled micro-flux coating on solder preforms. The chemistry was designed specifically to produce lower void results at the thermal/ground interface of Bottom Terminated Component packages such as QFN, QFP, and D-Pak. Incorporating ALPHA AccuFlux BTC-578 flux coated preforms and solder paste with an optimized stencil design results in minimal to non-detectable flux residues, meeting the most demanding electro-chemical reliability requirements. This technology can easily be implemented into an existing SMT circuit assembly process. Product Features Efficient heat dissipation through consistently low voids Enhanced process stability and predictable reliability through repeatable void distribution Maximizes mechanical integrity through increased solder volume Enhanced electrochemical reliability on shrinking component packages through low flux residue
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Suppliers

Company
Product
Description
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ALPHA ® AccuFlux ® BTC-578 Solder Preforms -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
ALPHA ® AccuFlux ® BTC-578 Solder Preforms
ALPHA ® AccuFlux ® BTC-578 Solder Preforms
Designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components. Product Overview ALPHA AccuFlux BTC-578 technology is a precision controlled micro-flux coating on solder preforms. The chemistry was designed specifically to produce lower void results at the thermal/ground interface of Bottom Terminated Component packages such as QFN, QFP, and D-Pak. Incorporating ALPHA AccuFlux BTC-578 flux coated preforms and solder paste with an optimized stencil design results in minimal to non-detectable flux residues, meeting the most demanding electro-chemical reliability requirements. This technology can easily be implemented into an existing SMT circuit assembly process. Product Features Efficient heat dissipation through consistently low voids Enhanced process stability and predictable reliability through repeatable void distribution Maximizes mechanical integrity through increased solder volume Enhanced electrochemical reliability on shrinking component packages through low flux residue

Designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components.

Product Overview

ALPHA AccuFlux BTC-578 technology is a precision controlled micro-flux coating on solder preforms. The chemistry was designed specifically to produce lower void results at the thermal/ground interface of Bottom Terminated Component packages such as QFN, QFP, and D-Pak.

Incorporating ALPHA AccuFlux BTC-578 flux coated preforms and solder paste with an optimized stencil design results in minimal to non-detectable flux residues, meeting the most demanding electro-chemical reliability requirements. This technology can easily be implemented into an existing SMT circuit assembly process.


Product Features

  • Efficient heat dissipation through consistently low voids
  • Enhanced process stability and predictable reliability through repeatable void distribution
  • Maximizes mechanical integrity through increased solder volume
  • Enhanced electrochemical reliability on shrinking component packages through low flux residue
Supplier's Site Datasheet

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Filler Alloys and Consumables
Product Name ALPHA ® AccuFlux ® BTC-578 Solder Preforms
Fluxes & Cleaners Soldering Flux / Rosin
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