Illinois Tool Works Inc. Solder 24-7150-8809

Description
Leaded No-Clean Wire Solder Sn62Pb36Ag2 (62/36/2) 22 AWG, 23 SWG Spool, 1 lb (454 g)
  • Solder - 24-7150-8809-ND - DigiKey
    DigiKey
  • Kester 245 Lead Solder Wire 24-7150-8809 - 1 lb - 0.025 in Wire Diameter - Sn/Pb/Ag Compound - 24-7150-8809 - R. S. Hughes Company, Inc.
    R. S. Hughes Company, Inc.
Request a Quote Datasheet
Description
Leaded No-Clean Wire Solder Sn62Pb36Ag2 (62/36/2) 22 AWG, 23 SWG Spool, 1 lb (454 g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - 24-7150-8809-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Solder
24-7150-8809-ND
Solder 24-7150-8809-ND
Leaded No-Clean Wire Solder Sn62Pb36Ag2 (62/36/2) 22 AWG, 23 SWG Spool, 1 lb (454 g)

Leaded No-Clean Wire Solder Sn62Pb36Ag2 (62/36/2) 22 AWG, 23 SWG Spool, 1 lb (454 g)

Buy Now Datasheet
Kester 245 Lead Solder Wire 24-7150-8809 - 1 lb - 0.025 in Wire Diameter - Sn/Pb/Ag Compound - 24-7150-8809 - R. S. Hughes Company, Inc.
R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Kester 245 Lead Solder Wire 24-7150-8809 - 1 lb - 0.025 in Wire Diameter - Sn/Pb/Ag Compound
24-7150-8809
Kester 245 Lead Solder Wire 24-7150-8809 - 1 lb - 0.025 in Wire Diameter - Sn/Pb/Ag Compound 24-7150-8809
The Kester 245 lead solder wire is another quality product from Kester. Melting point is reached at a temperature of +363 F. It's manufactured as an activated rosin flux core. Total composition for this lead solder wire is sn62/pb36/ag02.

The Kester 245 lead solder wire is another quality product from Kester. Melting point is reached at a temperature of +363 F. It's manufactured as an activated rosin flux core. Total composition for this lead solder wire is sn62/pb36/ag02.

Buy Now

Technical Specifications

  DigiKey R. S. Hughes Company, Inc.
Product Category Filler Alloys and Consumables Filler Alloys and Consumables
Product Number 24-7150-8809-ND 24-7150-8809
Product Name Solder Kester 245 Lead Solder Wire 24-7150-8809 - 1 lb - 0.025 in Wire Diameter - Sn/Pb/Ag Compound
Joining Process / Product Form Solid wire or rod; Spool, 1 lb (454 g) Solid wire or rod
Unlock Full Specs
to access all available technical data

Similar Products

Semiconductor Solder Flux for Packaging - ALPHA ® WS9180-MHV Flux - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Semiconductor Solder Flux for Packaging
ALPHA ® WS9180-MHV Flux
Specs
Solder Alloy Tin-Lead Alloy Solder (SN-Pb); Lead Free
Fluxes & Cleaners Soldering Flux / Rosin
View Details
Solder - 1796663 - RS Components, Ltd.
RS Components, Ltd.
Solder
1796663
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0472 inch (1.2 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb)
View Details
Aluminum TIG Rod - - Detroit Torch & Mfg. Co.
Detroit Torch & Mfg. Co.
Aluminum TIG Rod
Specs
Joining Process / Product Form Rod
Welding Filler Types Aluminum
Weld Positions All positions
View Details
Coated Electrode - Alloy C-276 - Universal Wire Works Inc.
Universal Wire Works Inc.
Coated Electrode
Alloy C-276
Specs
Joining Process / Product Form Solid wire or rod
Diameter / Thickness 0.0937 to 0.1875 inch (2.38 to 4.76 mm)
Nominal Composition .02C-2.5Co-16.5Cr-7Fe-1Mn-17Mo-.04P-.03S-.08Si-.35V-4.5W-BalanceNi
View Details