Huawei Technologies Co., Ltd. V3 Compute Node FusionServer CH121L

This liquid cooling compute node combines dense computing with an ultra-large memory. It is optimized for enterprise service applications such as virtualization, cloud computing, and High-Performance Computing (HPC). It forms part of the CH100 and CH200 families of compute nodes, which are fully compatible with Huawei’s E9000 Blade Server. This efficient compute node features dynamic energy-saving and power-capping technologies that manage and control power consumption with remarkably reduced low-load operating power. Carrier-class design, manufacturing, and components ensure high quality. Form Factor Half-width 2-socket compute node Number of Processors 1 or 2 Processor Model Intel® Xeon® E5-2600 v3/v4 series Number of DIMMs 24 DDR4 DIMMs, providing a maximum memory capacity of 1.5 TB