Henkel Corporation - Industrial Potting, Encapsulating and Injection Molding Compounds LOCTITE ECCOBOND E 1216M

LOCTITE ECCOBOND E 1216M, Epoxy, Underfill LOCTITE® ECCOBOND E 1216M innovative capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that fully cures in a single reflow cycle, but is stable enough to be easily shipped and used in large volume cartridges (up to 20 oz). It is specifically formulated to eliminate anhydride-type curing agents for those users who prefer to work with anhydride-free products. High Tg Snap curable Fast, void-free underfill of area array devices Excellent stability during shipping, storage and use Excellent adhesion and strength Non-anhydride curing chemistry