Dongguan Sheen Electronic Technology Co., Ltd. Carbon Fiber Thermal Pad for Communication and Power Equipment CSF35

CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application and rework. ◆ High compressibility, softness, and elasticity suitable for low-pressure applications. ◆ Low silicone oil bleed. ◆ Customizable shapes per client requirements. ◆ Compliant with RoHS, Halogen, REACH environmental and safety standards. ◆ Excellent flexibility, resilience, and thermal stability. 【Applications】 ◆ 5G Base Station RRU ◆ Chips ◆ Capacitors ◆ Memory/Graphics Memory Particles ◆ Hard Drives ◆ Control Boards ◆ Shunts ◆ Relays