Extreme Engineering Solutions, Inc. (X-ES) Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O XPand1007

Description
The XPand1007 system is a development platform for conduction-cooled 3U VPX cards. It supports up to two 0.8 in. or 1.0 in. 3U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. The XPand1007 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. Optionally, the XPand1007 can be configured with Dual Fat Pipe (DFP) J1 interconnects, with the remaining I/O from the payload passed to the RTM. Power and reset LEDs are provided for system status. Switches allow configuration for the included VITA 62 power supply, as well as reset and other I/O signals. Power is provided via the included 3U VPX VITA 62 power supply. An included external XPm9001 power supply plugs into a standard 120 V wall outlet to produce 24 V DC to power the VITA 62 supply. The XPand1007 dissipates heat from the conduction-cooled modules to sidewall heat exchangers, where it is quietly dissipated to the ambient environment by forced-air cooling. The XPand1007 is currently available for purchase in several rapid-development standard configurations. Custom configurations of modules, RTMs, and backplanes are also available utilizing X-ES and third-party components. Features Development platform for two conduction-cooled 3U VPX modules Compatible with multiple OpenVPX™ profiles Utilizes Rear Transition Modules (RTMs) for I/O access Forced-air-cooled sidewall heat exchangers Supports 0.8 in. or 1.0 in. pitch conduction-cooled VPX modules Supports VITA 48.2 REDI Standard VPX configurations in stock Options for Dual Fat Pipe (DFP) J1 interconnects or J1 I/O slot isolation with full I/O pass-through to RTM slots Customizable with X-ES and third-party components Power and reset switches Power and reset LEDs Designed for lab use up to 30°C ambient Input power via included VITA 62 power supply Includes external XPm9001 power supply Technical Specs Two 3U VPX-REDI (VITA 48.2) 0.8 in. or 1.0 in. pitch slots Two 3U VPX (VITA 46.10) RTM slots One 3U VPX VITA 62 power supply slot Options for Dual Fat Pipe (DFP) J1 interconnects or J1 I/O slot isolation with full I/O pass-through to RTM slots Configurable I/O (NVMRO, geographical addresses, SYSCON) via DIP switches VBAT supplied by VITA 62 supply, battery, or external power source Power Included 3U VPX VITA 62 power supply Included external XPm9001 power supply Physical Characteristics Dimensions: 11.9 in. (L) x 5.6 in. (W) x 9.3 in. (H) 10 lbs. with backplane
  • Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O - XPand1007 - Extreme Engineering Solutions, Inc. (X-ES)
    Extreme Engineering Solutions, Inc. (X-ES)
Description
The XPand1007 system is a development platform for conduction-cooled 3U VPX cards. It supports up to two 0.8 in. or 1.0 in. 3U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. The XPand1007 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. Optionally, the XPand1007 can be configured with Dual Fat Pipe (DFP) J1 interconnects, with the remaining I/O from the payload passed to the RTM. Power and reset LEDs are provided for system status. Switches allow configuration for the included VITA 62 power supply, as well as reset and other I/O signals. Power is provided via the included 3U VPX VITA 62 power supply. An included external XPm9001 power supply plugs into a standard 120 V wall outlet to produce 24 V DC to power the VITA 62 supply. The XPand1007 dissipates heat from the conduction-cooled modules to sidewall heat exchangers, where it is quietly dissipated to the ambient environment by forced-air cooling. The XPand1007 is currently available for purchase in several rapid-development standard configurations. Custom configurations of modules, RTMs, and backplanes are also available utilizing X-ES and third-party components. Features Development platform for two conduction-cooled 3U VPX modules Compatible with multiple OpenVPX™ profiles Utilizes Rear Transition Modules (RTMs) for I/O access Forced-air-cooled sidewall heat exchangers Supports 0.8 in. or 1.0 in. pitch conduction-cooled VPX modules Supports VITA 48.2 REDI Standard VPX configurations in stock Options for Dual Fat Pipe (DFP) J1 interconnects or J1 I/O slot isolation with full I/O pass-through to RTM slots Customizable with X-ES and third-party components Power and reset switches Power and reset LEDs Designed for lab use up to 30°C ambient Input power via included VITA 62 power supply Includes external XPm9001 power supply Technical Specs Two 3U VPX-REDI (VITA 48.2) 0.8 in. or 1.0 in. pitch slots Two 3U VPX (VITA 46.10) RTM slots One 3U VPX VITA 62 power supply slot Options for Dual Fat Pipe (DFP) J1 interconnects or J1 I/O slot isolation with full I/O pass-through to RTM slots Configurable I/O (NVMRO, geographical addresses, SYSCON) via DIP switches VBAT supplied by VITA 62 supply, battery, or external power source Power Included 3U VPX VITA 62 power supply Included external XPm9001 power supply Physical Characteristics Dimensions: 11.9 in. (L) x 5.6 in. (W) x 9.3 in. (H) 10 lbs. with backplane
Datasheet
Datasheet Summary
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The XPand1007 is a development platform designed for two conduction-cooled 3U VPX modules, supporting both 0.8 in. and 1.0 in. pitch configurations. It is compatible with multiple OpenVPX profiles and utilizes Rear Transition Modules (RTMs) for efficient I/O access, facilitating rapid system prototyping. The platform can be configured for dual I/O isolated slots or with Dual Fat Pipe (DFP) J1 interconnects, allowing for flexible I/O management. Power is supplied through an included VITA 62 power supply, with an external XPm9001 power supply that connects to standard 120 V outlets to provide 24 V DC. The system features forced-air-cooled sidewall heat exchangers for effective thermal management, designed for lab environments with ambient temperatures up to 30¬8C. The physical dimensions of the XPand1007 are 11.9 in. (L) x 5.6 in. (W) x 9.3 in. (H), and it weighs 10 lbs. with the backplane. Custom configurations are available, allowing integration with X-ES and third-party components.

Datasheet Summary
Powered by GS/AI

The XPand1007 is a development platform designed for two conduction-cooled 3U VPX modules, supporting both 0.8 in. and 1.0 in. pitch configurations. It is compatible with multiple OpenVPX profiles and utilizes Rear Transition Modules (RTMs) for efficient I/O access, facilitating rapid system prototyping. The platform can be configured for dual I/O isolated slots or with Dual Fat Pipe (DFP) J1 interconnects, allowing for flexible I/O management. Power is supplied through an included VITA 62 power supply, with an external XPm9001 power supply that connects to standard 120 V outlets to provide 24 V DC. The system features forced-air-cooled sidewall heat exchangers for effective thermal management, designed for lab environments with ambient temperatures up to 30¬8C. The physical dimensions of the XPand1007 are 11.9 in. (L) x 5.6 in. (W) x 9.3 in. (H), and it weighs 10 lbs. with the backplane. Custom configurations are available, allowing integration with X-ES and third-party components.

Suppliers

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Product
Description
Supplier Links
Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O - XPand1007 - Extreme Engineering Solutions, Inc. (X-ES)
Extreme Engineering Solutions, Inc. (X-ES)
Verona, WI, United States
Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
XPand1007
Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O XPand1007
The XPand1007 system is a development platform for conduction-cooled 3U VPX cards. It supports up to two 0.8 in. or 1.0 in. 3U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. The XPand1007 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. Optionally, the XPand1007 can be configured with Dual Fat Pipe (DFP) J1 interconnects, with the remaining I/O from the payload passed to the RTM. Power and reset LEDs are provided for system status. Switches allow configuration for the included VITA 62 power supply, as well as reset and other I/O signals. Power is provided via the included 3U VPX VITA 62 power supply. An included external XPm9001 power supply plugs into a standard 120 V wall outlet to produce 24 V DC to power the VITA 62 supply. The XPand1007 dissipates heat from the conduction-cooled modules to sidewall heat exchangers, where it is quietly dissipated to the ambient environment by forced-air cooling. The XPand1007 is currently available for purchase in several rapid-development standard configurations. Custom configurations of modules, RTMs, and backplanes are also available utilizing X-ES and third-party components. Features Development platform for two conduction-cooled 3U VPX modules Compatible with multiple OpenVPX™ profiles Utilizes Rear Transition Modules (RTMs) for I/O access Forced-air-cooled sidewall heat exchangers Supports 0.8 in. or 1.0 in. pitch conduction-cooled VPX modules Supports VITA 48.2 REDI Standard VPX configurations in stock Options for Dual Fat Pipe (DFP) J1 interconnects or J1 I/O slot isolation with full I/O pass-through to RTM slots Customizable with X-ES and third-party components Power and reset switches Power and reset LEDs Designed for lab use up to 30°C ambient Input power via included VITA 62 power supply Includes external XPm9001 power supply Technical Specs Two 3U VPX-REDI (VITA 48.2) 0.8 in. or 1.0 in. pitch slots Two 3U VPX (VITA 46.10) RTM slots One 3U VPX VITA 62 power supply slot Options for Dual Fat Pipe (DFP) J1 interconnects or J1 I/O slot isolation with full I/O pass-through to RTM slots Configurable I/O (NVMRO, geographical addresses, SYSCON) via DIP switches VBAT supplied by VITA 62 supply, battery, or external power source Power Included 3U VPX VITA 62 power supply Included external XPm9001 power supply Physical Characteristics Dimensions: 11.9 in. (L) x 5.6 in. (W) x 9.3 in. (H) 10 lbs. with backplane

The XPand1007 system is a development platform for conduction-cooled 3U VPX cards. It supports up to two 0.8 in. or 1.0 in. 3U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. The XPand1007 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. Optionally, the XPand1007 can be configured with Dual Fat Pipe (DFP) J1 interconnects, with the remaining I/O from the payload passed to the RTM. Power and reset LEDs are provided for system status. Switches allow configuration for the included VITA 62 power supply, as well as reset and other I/O signals.

Power is provided via the included 3U VPX VITA 62 power supply. An included external XPm9001 power supply plugs into a standard 120 V wall outlet to produce 24 V DC to power the VITA 62 supply.

The XPand1007 dissipates heat from the conduction-cooled modules to sidewall heat exchangers, where it is quietly dissipated to the ambient environment by forced-air cooling.

The XPand1007 is currently available for purchase in several rapid-development standard configurations. Custom configurations of modules, RTMs, and backplanes are also available utilizing X-ES and third-party components.


Features

  • Development platform for two conduction-cooled 3U VPX modules
  • Compatible with multiple OpenVPX™ profiles
  • Utilizes Rear Transition Modules (RTMs) for I/O access
  • Forced-air-cooled sidewall heat exchangers
  • Supports 0.8 in. or 1.0 in. pitch conduction-cooled VPX modules
  • Supports VITA 48.2 REDI
  • Standard VPX configurations in stock
  • Options for Dual Fat Pipe (DFP) J1 interconnects or J1 I/O slot isolation with full I/O pass-through to RTM slots
  • Customizable with X-ES and third-party components
  • Power and reset switches
  • Power and reset LEDs
  • Designed for lab use up to 30°C ambient
  • Input power via included VITA 62 power supply
  • Includes external XPm9001 power supply

Technical Specs

  • Two 3U VPX-REDI (VITA 48.2) 0.8 in. or 1.0 in. pitch slots
  • Two 3U VPX (VITA 46.10) RTM slots
  • One 3U VPX VITA 62 power supply slot
  • Options for Dual Fat Pipe (DFP) J1 interconnects or J1 I/O slot isolation with full I/O pass-through to RTM slots
  • Configurable I/O (NVMRO, geographical addresses, SYSCON) via DIP switches
  • VBAT supplied by VITA 62 supply, battery, or external power source

Power

  • Included 3U VPX VITA 62 power supply
  • Included external XPm9001 power supply

Physical Characteristics

  • Dimensions: 11.9 in. (L) x 5.6 in. (W) x 9.3 in. (H)
  • 10 lbs. with backplane
Supplier's Site Datasheet

Technical Specifications

  Extreme Engineering Solutions, Inc. (X-ES)
Product Category VME, VPX, and VXI Bus Interfaces and Adapters
Product Number XPand1007
Product Name Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
Technology VPX
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