Ideal for space constrained applications where high compute density requirements and SWaP concerns are key.
Ruggedize your SBC or bundle it in a fully integrated package including mezzanine options and OS integration sold and supported under a single assembly number.
Features:
Intel Core i7 integrated dual core processor (1.06 GHz ULV or 2.0 GHz LV)
Up to 8GB ECC-protected DDR3-800/1066 (soldered)
256KB non-volatile F-RAM
Mobile Intel® 5 Series chipset:Ibex Peak-M PCH
VGA interface
Two on-board Gigabit Ethernet interfaces
Two USB 2.0 (front air cooled)
Four USB 2.0 ports (rear)
Four PCI Express interfaces
Two SATA interfaces
One UART port
Full PICMG 2.1, R2.0 Hot Swap specification compliance
PICMG 2.9 System Management specification support
PICMG 2.30 CompactPCI® PlusIO compatible pinouts for J2 USB, SATA and PCI Express
Air and conduction cooled
Extended temperature range (-40 °C to +85 °C)
Optional rear transition module
Ideal for space constrained applications where high compute density requirements and SWaP concerns are key.
Ruggedize your SBC or bundle it in a fully integrated package including mezzanine options and OS integration sold and supported under a single assembly number.
Features:
- Intel Core i7 integrated dual core processor (1.06 GHz ULV or 2.0 GHz LV)
- Up to 8GB ECC-protected DDR3-800/1066 (soldered)
- 256KB non-volatile F-RAM
- Mobile Intel® 5 Series chipset:Ibex Peak-M PCH
- VGA interface
- Two on-board Gigabit Ethernet interfaces
- Two USB 2.0 (front air cooled)
- Four USB 2.0 ports (rear)
- Four PCI Express interfaces
- Two SATA interfaces
- One UART port
- Full PICMG 2.1, R2.0 Hot Swap specification compliance
- PICMG 2.9 System Management specification support
- PICMG 2.30 CompactPCI® PlusIO compatible pinouts for J2 USB, SATA and PCI Express
- Air and conduction cooled
- Extended temperature range (-40 °C to +85 °C)
- Optional rear transition module
