Hernon Manufacturing, Inc. Formulations - Applications - Bonding - Tuffbond 305 3305AB22

Description
Tuffbond® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 305 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
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Formulations - Applications - Bonding - Tuffbond 305 - 3305AB22 - Hernon Manufacturing, Inc.
Sanford, FL, United States
Formulations - Applications - Bonding - Tuffbond 305
3305AB22
Formulations - Applications - Bonding - Tuffbond 305 3305AB22
Tuffbond® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 305 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Tuffbond® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 305 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

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Technical Specifications

  Hernon Manufacturing, Inc.
Product Category Industrial Adhesives
Product Number 3305AB22
Product Name Formulations - Applications - Bonding - Tuffbond 305
Chemical System Ceramic; Epoxy
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