ResinLab EP1112NC Clear is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part A, 5 gal Pail.
| Ellsworth Adhesives | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | EP1112NC CLEAR - A PL |
| Product Name | ResinLab EP1112NC Epoxy Encapsulant Part A Clear 5 gal Pail |
| Cure / Technology | Two Component |
| Chemical System | Epoxy |
| Thermal Conductivity | 0.1400 W/m-K (0.0809 BTU-ft/hr-ft²-F) |
| Tensile (Break) | 3000 psi (20684 KPa) |
