Hernon Manufacturing, Inc. Formulations - Applications - Bonding - Tuffbond 315 3315AB22

Description
Tuffbond® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 315 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Datasheet
Description
Tuffbond® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 315 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Formulations - Applications - Bonding - Tuffbond 315 - 3315AB22 - Hernon Manufacturing, Inc.
Sanford, FL, United States
Formulations - Applications - Bonding - Tuffbond 315
3315AB22
Formulations - Applications - Bonding - Tuffbond 315 3315AB22
Tuffbond® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 315 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Tuffbond® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 315 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Supplier's Site Datasheet

Technical Specifications

  Hernon Manufacturing, Inc.
Product Category Industrial Adhesives
Product Number 3315AB22
Product Name Formulations - Applications - Bonding - Tuffbond 315
Chemical System Ceramic; Epoxy
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