Resinlab ResinLab EP1112 Epoxy Encapsulant Part A Black 5 gal Pail EP1112 BLACK A PL

Description
ResinLab EP1112 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part A, 5 gal Pail.
Request a Quote Datasheet
Description
ResinLab EP1112 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part A, 5 gal Pail.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
ResinLab EP1112 Epoxy Encapsulant Part A Black 5 gal Pail - EP1112 BLACK - A PL - Ellsworth Adhesives
Germantown, WI, USA
ResinLab EP1112 Epoxy Encapsulant Part A Black 5 gal Pail
EP1112 BLACK - A PL
ResinLab EP1112 Epoxy Encapsulant Part A Black 5 gal Pail EP1112 BLACK - A PL
ResinLab EP1112 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part A, 5 gal Pail.

ResinLab EP1112 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part A, 5 gal Pail.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Encapsulants and Potting Compounds
Product Number EP1112 BLACK - A PL
Product Name ResinLab EP1112 Epoxy Encapsulant Part A Black 5 gal Pail
Cure / Technology Two Component  
Chemical System Epoxy
Thermal Conductivity 0.1700 W/m-K (0.0982 BTU-ft/hr-ft²-F)
Tensile (Break) 1200 psi (8274 KPa)
Unlock Full Specs
to access all available technical data

Similar Products

Silicone Conformal Coating, UL Listed - ACC17 - CHT USA Inc.
Specs
Form / Function Encapsulant or Conformal Coating
Cure / Technology Alkoxy
Features UL Rating
View Details
Carbon Fiber Encapsulation - Wraptite® - Arnold Magnetic Technologies
Arnold Magnetic Technologies
Specs
Cure / Technology Wound in place or pressed on sleeve
Chemical System Include Carbon Fiber, Zylon Fiber And Glass Fiber Composites
Industry Aerospace; Automotive; OEM or Industrial; Oil and Gas
View Details
Dymax Multi-Cure 987 UV Curing Conformal Coating Clear 1 L Bottle - 987 1 LITER BOTTLE - Ellsworth Adhesives
Specs
Form / Function Encapsulant or Conformal Coating
Tensile (Break) 5300 psi (36542 KPa)
Elongation 4.0 %
View Details
Electrically Insulative, Toughened Epoxy Meets NASA Low Outgassing Specifications - Supreme 42HT-2ND Black - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Gap Fill 0.0020 to 0.0040 inch (0.0508 to 0.1016 mm)
View Details