Resinlab ResinLab EP1112 Epoxy Encapsulant Part A Black 5 gal Pail EP1112 BLACK A PL

Description
ResinLab EP1112 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part A, 5 gal Pail.
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Description
ResinLab EP1112 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part A, 5 gal Pail.
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Suppliers

Company
Product
Description
Supplier Links
ResinLab EP1112 Epoxy Encapsulant Part A Black 5 gal Pail - EP1112 BLACK - A PL - Ellsworth Adhesives
Germantown, WI, USA
ResinLab EP1112 Epoxy Encapsulant Part A Black 5 gal Pail
EP1112 BLACK - A PL
ResinLab EP1112 Epoxy Encapsulant Part A Black 5 gal Pail EP1112 BLACK - A PL
ResinLab EP1112 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part A, 5 gal Pail.

ResinLab EP1112 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part A, 5 gal Pail.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Encapsulants and Potting Compounds
Product Number EP1112 BLACK - A PL
Product Name ResinLab EP1112 Epoxy Encapsulant Part A Black 5 gal Pail
Cure / Technology Two Component  
Chemical System Epoxy
Thermal Conductivity 0.1700 W/m-K (0.0982 BTU-ft/hr-ft²-F)
Tensile (Break) 1200 psi (8274 KPa)
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