Hernon Manufacturing, Inc. Formulations - Applications - Bonding - Tuffbond 304 3304AB46

Description
Tuffbond® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 304 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Datasheet
Description
Tuffbond® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 304 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Datasheet

Suppliers

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Product
Description
Supplier Links
Formulations - Applications - Bonding - Tuffbond 304 - 3304AB46 - Hernon Manufacturing, Inc.
Sanford, FL, United States
Formulations - Applications - Bonding - Tuffbond 304
3304AB46
Formulations - Applications - Bonding - Tuffbond 304 3304AB46
Tuffbond® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 304 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Tuffbond® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond® 304 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Supplier's Site Datasheet

Technical Specifications

  Hernon Manufacturing, Inc.
Product Category Industrial Adhesives
Product Number 3304AB46
Product Name Formulations - Applications - Bonding - Tuffbond 304
Chemical System Ceramic; Epoxy
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