ECS Inc. International Through Hole Crystals ECS-3X10X

Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Datasheet
Datasheet Summary
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ECS-3X10X is a miniature tubular quartz crystal designed for high-frequency applications, offering frequency operation from 3.50 to 9.83 MHz with a load capacitance of 16 pF typical. It operates within a temperature range of -10 to +60°C and maintains frequency stability of ±50 ppm over this range. The crystal supports fundamental mode operation up to 10.00 MHz with a maximum equivalent series resistance of 100 Ω for frequencies between 6.00 and 10.00 MHz. It features a maximum drive level of 100 μW, insulation resistance of 500 MΩ minimum under 100 V DC, and aging of ±5 ppm maximum over the first year at +25°C. The package measures 3 mm by 10 mm and is RoHS compliant. The part supports reflow soldering with a peak temperature of +260°C for up to 10 seconds and has an MSL rating of 1.

Datasheet Summary
Powered by GS/AI

ECS-3X10X is a miniature tubular quartz crystal designed for high-frequency applications, offering frequency operation from 3.50 to 9.83 MHz with a load capacitance of 16 pF typical. It operates within a temperature range of -10 to +60°C and maintains frequency stability of ±50 ppm over this range. The crystal supports fundamental mode operation up to 10.00 MHz with a maximum equivalent series resistance of 100 Ω for frequencies between 6.00 and 10.00 MHz. It features a maximum drive level of 100 μW, insulation resistance of 500 MΩ minimum under 100 V DC, and aging of ±5 ppm maximum over the first year at +25°C. The package measures 3 mm by 10 mm and is RoHS compliant. The part supports reflow soldering with a peak temperature of +260°C for up to 10 seconds and has an MSL rating of 1.

Suppliers

Company
Product
Description
Supplier Links
Through Hole Crystals - ECS-3X10X - ECS Inc. International
Lenexa, KS, United States
Through Hole Crystals
ECS-3X10X
Through Hole Crystals ECS-3X10X
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications.

Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors.

Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Supplier's Site Datasheet

Technical Specifications

  ECS Inc. International
Product Category Crystals
Product Number ECS-3X10X
Product Name Through Hole Crystals
Package / Form Factor Through Hole Crystals
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