Dongguan Sheen Electronic Technology Co., Ltd. High efficiency thermal pad for chipset SF700

The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft, reducing assembly stress and protecting sensitive and fragile components. ◆ Self-adhesive for easy application and rework. ◆ Customizable die-cut shapes to meet specific customer needs. ◆ Exceptional tensile strength and abrasion resistance. ◆ Excellent electrical insulation properties. ◆ Superior flame resistance, achieving a UL94 V-0 rating. ◆ Low silicone oil bleed and low siloxane volatility, minimizing impact on equipment. ◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. 【Applications】 ◆ Electric Vehicle Battery Management System ◆ CPU/GPU Chips ◆ Capacitors ◆ Memory/VRAM particles ◆ Control boards ◆ Splitters ◆ Relays