Merrimac Industries, Inc. Zapper® N Package CSDZ-5N-2.5G

Description
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.
Datasheet
Description
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Zapper® N Package - CSDZ-5N-2.5G - Merrimac Industries, Inc.
West Caldwell, NJ, USA
Zapper® N Package
CSDZ-5N-2.5G
Zapper® N Package CSDZ-5N-2.5G
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.

Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.

Supplier's Site Datasheet

Technical Specifications

  Merrimac Industries, Inc.
Product Category RF Couplers
Product Number CSDZ-5N-2.5G
Product Name Zapper® N Package
RF Coupler Type Uni-Directional
Package Type Surface Mount
Frequency Range 2000.00 to 3000.00 MHz
Unlock Full Specs
to access all available technical data

Similar Products

500 to 2500MHz – Directional Coupler - UIYDCP13315A - UIY Inc.
Specs
Frequency Range 500.00 to 2500.00 MHz
Power 50.00 watts
Coupling 10.00 to 30.00 dB
View Details
Directional Coupler - 5o5555250 - 5o.com
Specs
RF Coupler Type Uni-Directional
Frequency Range 2000.00 to 8000.00 MHz
Power 50.00 watts
View Details
Signal Distribution: High Frequency Film Cards -  - Molex Signal Tech Industrial Ltd.
Molex Signal Tech Industrial Ltd.
Specs
Package Type Surface Mount
Frequency Range 20000.00 MHz
Coupling 3.00 dB
View Details