Merrimac Industries, Inc. Zapper® N Package CSDZ-20N-.312G

Description
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.
Datasheet
Description
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.
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Zapper® N Package - CSDZ-20N-.312G - Merrimac Industries, Inc.
West Caldwell, NJ, USA
Zapper® N Package
CSDZ-20N-.312G
Zapper® N Package CSDZ-20N-.312G
Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.

Multi-Mix® Microtechnology is a new innovative process for microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. The fusion process provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies.

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Technical Specifications

  Merrimac Industries, Inc.
Product Category RF Couplers
Product Number CSDZ-20N-.312G
Product Name Zapper® N Package
RF Coupler Type Uni-Directional
Package Type Surface Mount
Frequency Range 225.00 to 400.00 MHz
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